Wroclaw University of Technology (logo) WEMiF: Faculty of Microsystem Electronics and Photonics (logo) LIPEC: Laboratory for Interconnecting and Packaging Electronic Circuits LIPEC LIPEC

MANUFACTURING

Name Type Photo
System for drilling, milling and engraving of PCB base materials BUNGARD CCD Bungard Electronic
Stencil printer SPOT 20/20 Advanced Techniques  
Semi-automatic pick-and place system CAT 90 Advanced Techniques
Forced convection reflow oven JEM 310 OK Industries
Manual and semi-automatic thermo-ultrasonic wire bonder BONDER 5410 Delvotec
Sonic wire bonder U-WB-BU1A TSK International Corporation  
Epoxy die mounter and pull tester micro-manipulator system GM-100 ATU Technologie GmbH  
System for the rework, repair and assembly of mixed technology PCB's MTR-5000 OK Industries
Ink-jet printer for user made inks Dimatix Fujifilm DMP-2811
BGA Rework Station Jovy RE-7500
Sonificator Sonics Vibra-Cell VCX130 / CV18