Wroclaw University of Technology (logo) WEMiF: Faculty of Microsystem Electronics and Photonics (logo) LIPEC: Laboratory for Interconnecting and Packaging Electronic Circuits LIPEC LIPEC
Year Authors Title Editor
2017Gierczak M., Stojek K., Dziedzic A.Temperature distribution on a quad-core microprocessor and quad-core microprocessor/heat sink structure.Przegląd Elektrotechniczny. 2017, R. 93, nr 2, s. 210-213.
2017A. Mościcki, A. Smolarek-Nowak, J. Felba, A. Kinart Ink for Ink-Jet Printing of Electrically Conductive Structures on Flexible Substrates with Low Thermal Resistance Journal of Electronic Materials, Published online 14 February 2017
2016Gierczak M., Markowski M. P., Żaluk Z., Dziedzic A., Jankowski-Mihułowicz P.Ink-Jet printed conductive films - geometrical and electrical characterization.ISSE 2016 : 39th International Spring Seminar on Electronics Technology [Dokument elektroniczny] : "Printed Electronics and Smart Textiles" : Extended Abstracts, May 18-22, 2016, Pilsen, Czech Republik / eds. Tomáš Blecha [i in.]. Pilsen : University of West Bohemia, 2016. s. 1-6.
2016Myśliwiec M., Kisiel R., Fałat T. Die attach by diffusion Sn-Ag-Sn soldering in high temperature electronics applications. ISSE 2016 : 39th International Spring Seminar on Electronics Technology [Dokument elektroniczny] : "Printed Electronics and Technology [Dokument elektroniczny] : "Printed Electronics and Smart Textiles" : Extended Abstracts, May 18-22, 2016, Pilsen, Czech Republik / eds. Tomáš Blecha [i in.]. Pilsen : University of West Bohemia, 2016. s. 140-143.
2016Nowak D., Dziedzic A., Żaluk Z., Roguszczak H., Węglarski M. Mechanical properties of SDM interconnections on flexible and rigid substrates. Soldering & Surface Mount Technology. 2016, vol. 28, nr 1, s. 27-32.
2016Sikora A., Bednarz Ł., Fałat T., Wałecki M., Adamowska M. Investigation of the impact of simulated solar radiation on the micro-and nanoscale morphology and mechanical properties of a sheet moulded composite surface.Materials Science-Poland. 2016, vol. 34, nr 3, s. 641-649
2016Stojek K., Fałat T., Felba J. Matkowski K. P., Macherzyński W., Mościcki A. Thermal joints based on sintered silver micro- and nano- sized particles. ISSE 2016 : 39th International Spring Seminar on Electronics Technology [Dokument elektroniczny] : "Printed Electronics and Smart Textiles" : Extended Abstracts, May 18-22, 2016, Pilsen, Czech Republik / eds. Tomáš Blecha [i in.]. Pilsen : University of West Bohemia, 2016. s. 116-121.
2016Wiejak W., Wymysłowski A. Experimental approach to validation of an analytical and numerical thermal analysis of a travelling wave tube 39th International Microelectronics and Packaging IMAPS 2015 Conference [Dokument elektroniczny] : 20-23 September 2015, Gdańsk, Poland / eds. Piotr Jasiński, Krzysztof Górecki, Robert Bogdanowicz. Bristol : IOP Publishing, 2016. art. 012010, s. 1-9.
2016Wymysłowski A., Górecka-Drzazga A., Sareło K. Analytical, numerical and experimental approach to analysis properties of a silicon membrane pressure sensor 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 [Dokument elektroniczny] : Montpellier, France, April 18-20, 2016. [Piscataway, NJ] : IEEE, cop. 2016. s. 1-7.
2015Dąbrowska E., Teodorczyk M., Lipińska L., Krzyżak K., Dąbrowski A., Sobczak G., Kozłowska A., Matkowski P. K., Młożniak A., Maląg A.Zastosowanie tlenku grafenu i grafenu w technologii diod laserowych.Przegląd Elektrotechniczny. 2015, R. 91, nr 9, s. 1-4.
2015Fałat T., Matkowski P. K., Stojek K., Felba J., Płatek B., Mościcki A.The efficiency of heat transfer through the interface of sintered silver nanoparticles.Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems and ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels InterPACKICNMM2015 [Dokument elektroniczny] : San Francisco, California, USA, July 6-9, 2015. [B.m.] : ASME, cop. 2015. s. 1-5.
2015Fałat T., Płatek B.Growth of intermetallic compound between indium-based thermal interface material and copper substrate: molecular dynamics simulations.Materials Science-Poland. 2015, vol. 33, nr 2, s. 445-450.
2015Matkowski P. K., Fałat T., Mościcki A. Reliability of interconnections made of sintered silver nano particles.Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems and ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels InterPACKICNMM2015 [Dokument elektroniczny] : San Francisco, California, USA, July 6-9, 2015. [B.m.] : ASME, cop. 2015. s. 1-6.
2015Nowak D., Dziedzic A., Żaluk Z., Roguszczak H., Weglarski M. Investigation of mechanical properties of SDM interconnections on flexible and rigid substrates. 39th International Conference of IMAPS Poland [Dokument elektroniczny] : 20-23 September 2015, Gdańsk, Poland / Gdansk University of Technology [i in.]. [B.m. : b.w., 2015]. s. 1-9.
2015Stojek K., Płatek B., Fałat T., Felba J., Matkowski P. K., Mościcki A. The method of measuring the efficiency of heat transfer through thermal interface materials in microelectronics packaging.38th International Spring Seminar on Electronics Technology, ISSE 2015 [Dokument elektroniczny] : "Novel Trends in Electronics Manufacturing" : extended abstracts, May 6-10, 2015, Eger, Hungary / eds. Gábor Harsányi [i in.]. Budapest : Budapest University of Technology and Econimocs, 2015. s. 1-6.
2015Tesarski S., Wymysłowski A., Allaf K. N. Analysis of an influence of a conversion level on simulation results of the crosslinked polymers. Molecular modeling and multiscaling issues for electronic material applications. Vol. 2 / Artur Wymysłowski [i in.] eds. Cham [i in.] : Springer, cop. 2015. s. 175-194.
2015Wiejak W., Wymysłowski A. Experimental validation of an analytical and numerical approach to thermal analysis of a travelling wave tube.39th International Conference of IMAPS Poland [Dokument elektroniczny] : 20-23 September 2015, Gdańsk, Poland / Gdansk University of Technology [i in.]. [B.m. : b.w., 2015]. s. 1-9.
2015Wiejak W., Wymysłowski A. Analytical, numerical and experimental approach to thermal analysis and design of a travelling wave tube.16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 [Dokument elektroniczny]: Budapest, Hungary, April 20-22, 2015. [Piscataway, NJ] : IEEE, cop. 2015. s. 1-8.
2015Wymysłowski A. Adhesion work analysis by molecular modelling and wetting angle measurement. Microelectronics Reliability. 2015, vol. 55, nr 5, s. 713-715.
2015Wymysłowski A., Iwamoto N., Yuen M., Fan H. Adhesion work analysis by molecular modelling and wetting angle measurement http://link.springer.com/book/10.1007%2F978-3-319-12862-7
2014Allaf K. N., Król D. J., Wymysłowski A., Zubel I., Rola K. Adhesion work analysis by molecular modelling and wetting angle measurement 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Gent, Belgium, April 7-8-9, 2014 : IEEE, cop. 2014. s. 1-5.
2014Fałat T.,Płatek B., Matkowski P. K., Felba J., Zandén C., Ye L., Liu J. Experimental results versus numerical simulations of In/Cu intermetallic compounds growth and wetting angle measurement 16th Electronics Packaging Technology Conference, EPTC 2014 [Dokument elektroniczny] : 3-5 December 2014, Singapore.[Piscataway, NJ] : IEEE, cop. 2014. s. 797-800.
2014Fałat T., Stojek K., Matkowski P. K., Płatek B., Felba J., Mościcki A. Influence of sintering process parameters on mechanical strength of joints based on silver nano particles16th Electronics Packaging Technology Conference, EPTC 2014 [Dokument elektroniczny] : 3-5 December 2014, Singapore.[Piscataway, NJ] : IEEE, cop. 2014. s. 801-804.
2014Fałat T,Matkowski P. K.,Żaluk Z., Felba J., Mościcki A. Mechanical strength of joints based on Nano-Ag sintering phenomena37th International Spring Seminar on Electronics Technology, ISSE 2014 [Dokument elektroniczny] : ""Advances in Electronic System Integration"" : conference proceedings, May 7-11, 2014, Dresden, Germany / eds. Manuela Franz, Johann Nicolics, Heinz Wohlrabe. [Piscataway, NJ] : IEEE, cop. 2014. s. 365-368."
2014Jankowski K., Wymysłowski A. Acceleration of life prediction of solder joints using multi-failure criteria37th International Spring Seminar on Electronics Technology, ISSE 2014 [Dokument elektroniczny] : ""Advances in Electronic System Integration"" : extended abstracts, May 7-11, 2014, Dresden, Germany / [eds. Heinz Wohlrabe, Manuela Franz, Johann Nicolics.Templin] : Verlag Dr. Markus A. Detert, 2014. s. 1-5."
2014Jankowski K., Wymysłowski A. Creep and fatigue as main degradation phenomena in reliability of solder joints 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014 [Dokument elektroniczny] : proceedings of the conference, Gent, Belgium, April 7-8-9, 2014.[Piscataway, NJ] : IEEE, cop. 2014. s. 1-5.
2014Kłossowicz A. S.,Winiarski P. W., Zawierta M., Stęplewski W., Dziedzic A. Analysis of long-term stability of capacitors embedded in printed circuit boards 37th International Spring Seminar on Electronics Technology, ISSE 2014 [Dokument elektroniczny] : ""Advances in Electronic System Integration"" : extended abstracts, May 7-11, 2014, Dresden, Germany / [eds. Heinz Wohlrabe, Manuela Franz, Johann Nicolics.Templin] : Verlag Dr. Markus A. Detert, 2014. s. 1-6."
2014Matkowski P, K., Fałat T., Mościcki A. Comparative analysis of novel thermal interface containing nano additives 16th Electronics Packaging Technology Conference, EPTC 2014 [Dokument elektroniczny] : 3-5 December 2014, Singapore.[Piscataway, NJ] : IEEE, cop. 2014. s. 345-348.
2014Matkowski P, K., Fałat T., Mościcki A.Reliability testing of electrically conductive joints made of sintered nano silver 2014 Electronic System-Integration Technology Conference (ESTC) [Dokument elektroniczny] : September 16-18, 2014, Helsinki, Finland. Piscataway, NJ : IEEE, cop. 2014. s. 1-6.
2014Matkowski P. K., Fałat T., Żaluk Z., Felba J., Mościcki A. Structure of the thermal interface connection made of sintered nano silver 37th International Spring Seminar on Electronics Technology, ISSE 2014 [Dokument elektroniczny] : Advances in Electronic System Integration : conference proceedings, May 7-11, 2014, Dresden, Germany / eds. Manuela Franz, Johann Nicolics, Heinz Wohlrabe.[Piscataway, NJ] : IEEE, cop. 2014. s. 243-246.
2014Mościcki A., Fałat T., Kinart A., Smolarek A., Merten E. New nano size filled TIM material with high thermally conductive properties 16th Electronics Packaging Technology Conference, EPTC 2014 [Dokument elektroniczny] : 3-5 December 2014, Singapore.[Piscataway, NJ] : IEEE, cop. 2014. s. 449-452.
2014Palczyńska A., Wymysłowski A., Bieniek T., Janczyk G., Pasquet D., Dinh T. V.Crosstalk phenomena analysis using electromagnetic wave propagation by experimental an numerical simulation methods 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014 [Dokument elektroniczny] : proceedings of the conference, Gent, Belgium, April 7-8-9, 2014.[Piscataway, NJ] : IEEE, cop. 2014. s. 1-10.
2014Płatek B.,Fałat T., Matkowski P. K., Felba J., Mościcki A.Heat transfer through the interface containing sintered NanoAg based thermal interface material 2014 Electronic System-Integration Technology Conference (ESTC) [Dokument elektroniczny] : September 16-18, 2014, Helsinki, Finland. Piscataway, NJ : IEEE, cop. 2014. s. 1-4.
2014Płatek B., Fałat T., Felba J. Evaluation of the interfacial resistance between carbon nanotube and silicon by using molecular dynamics simulations 37th International Spring Seminar on Electronics Technology, ISSE 2014 [Dokument elektroniczny] : ""Advances in Electronic System Integration"" : conference proceedings, May 7-11, 2014, Dresden, Germany / eds. Manuela Franz, Johann Nicolics, Heinz Wohlrabe. [Piscataway, NJ] : IEEE, cop. 2014. s. 70-74."
2014Swierczyński R., Urbański K., Wymysłowski A. Improving co-design of smart sensor front-ends Mixed design of integrated circuits and systems, MIXDES 2014 [Dokument elektroniczny] : proceedings of the 21th international conference, Lublin, Poland, 19-21 June 2014 / [ed. by Andrzej Napieralski]. Łódź : Department of Microelectronics and Computer Science. Lodz University of Technology, cop. 2014. s. 236-240.
2014Swierczyński R., Urbański K., Wymysłowski A. Methodology for supporting electronic system prototyping through semiautomatic component selection 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014 [Dokument elektroniczny] : proceedings of the conference, Gent, Belgium, April 7-8-9, 2014.[Piscataway, NJ] : IEEE, cop. 2014. s. 1-4.
2014Urbański K., Fałat T., Matkowski P. K., Szczerba M., Felba J., Mościcki A. Investigation of electrical properties of contacts made of materials based on sintered nano-Ag particles 37th International Spring Seminar on Electronics Technology, ISSE 2014 [Dokument elektroniczny] : ""Advances in Electronic System Integration"" : conference proceedings, May 7-11, 2014, Dresden, Germany / eds. Manuela Franz, Johann Nicolics, Heinz Wohlrabe. [Piscataway, NJ] : IEEE, cop. 2014. s. 247-251."
2013Zawierta M., Płatek B., Fałat T., Felba J.Coarse Grained Molecular Dynamics Study of Heat Transfer in Thermal Interface Materials36th International Spring Seminar on Electronics Technology "Automotive Electronics", 8-12 May 2013, Alba Iulia, Romania : IEEE, cop. 2013. s. 259-262
2013Fałat T., Płatek B., Zawierta M., Felba J.Numerical study on thermal conductivity of nanomaterials - coarse grained molecular dynamics approach13th International Conference on Nanotechnology, August 5-8, 2013, Beijing, China. [B.m.] : IEEE, cop. 2013. s. 1159-1163.
2013Felba J., Fałat T., Mościcki A.Nano sized silver for electronic packaging13th International Conference on Nanotechnology, August 5-8, 2013, Beijing, China. [B.m.] : IEEE, cop. 2013. s. 30-33.
2013Płatek B., Fałat T., Felba J.Study on thermal conductivity of boron nitride in hexagonal structure in atomistic scale by using non-equilibrium molecular dynamics technique13th International Conference on Nanotechnology, August 5-8, 2013, Beijing, China. [B.m.] : IEEE, cop. 2013. s. 30-33.
2013Płatek B., Fałat T., Felba J.Molecular dynamics calculations of the growth rate constant and active energy for In/Cu compound in indium based thermal interface materialProceedings of 37th International Microelectronics and Packaging IMAPS-CPMT Poland Conference : 22-25 September 2013, Kraków, Poland. [Kraków : International Microelectronics and Packaging Society, IMAPS - Poland Chapter, 2013]. s. 1-5.
2013Chicot D., Tilkin K., Jankowski K., Wymysłowski A.Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation techniqueMicroelectronics Reliability. 2013, s. 1-6.
2013Jankowski K., Wymysłowski A., Chicot D.Combined loading and failure analysis of lead-free solder joints due to creep and fatigue phenomenaProceedings of 37th International Microelectronics and Packaging IMAPS-CPMT Poland Conference : 22-25 September 2013, Kraków, Poland. [Kraków : International Microelectronics and Packaging Society, IMAPS - Poland Chapter, 2013]. s. 1-6.
2013Jankowski K., Świerczyński R., Urbański K., Wymysłowski A., Chicot D., Dudek R.Maintenance of solder joints on the strength of simultaneously acting creep and fatigue phenomena by using microindentation technique14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 : proceedings of the conference, Wrocław, Poland, April 15-16-17, 2013. [Piscataway, NJ] : IEEE, cop. 2013. s. 1-4.
2013Król D. J., Wymysłowski A., Zubel I., Rola K.Application of molecular modelling for analysis of a surface energy and its comparison with the experimental results based on wetting angle measurement14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 : proceedings of the conference, Wrocław, Poland, April 15-16-17, 2013. [Piscataway, NJ] : IEEE, cop. 2013. s. 1-5.
2013Swierczyński R., Urbański K., Wymysłowski A., Jankowski K.Low-power smart sensor for laminar and turbulent flow detection in avionics application14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 : proceedings of the conference, Wrocław, Poland, April 15-16-17, 2013. [Piscataway, NJ] : IEEE, cop. 2013. s. 1-4.
2012Wymysłowski A.Challenges of thermo-mechanical numerical prototyping in the contemporary electronic packagingElektronika (Warszawa). 2012, R. 53, nr 2, s. 23-26
2012Wymysłowski A.Editorial : 2011 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systemsMicroelectronics Reliability. 2012, vol. 52, nr 7, s. 1253-1254
2012Wymysłowski A., Dowhań Ł.Warstwy cienkie w montażu elektronicznym - właściwości i niezawodność
2012Wymysłowski A., Dowhań Ł.Application of nanoindentation technique for investigation of elasto-plastic properties of the selected thin film materialsMicroelectronics Reliability. 2012, 9 s.
2012Weltevreden E., Tesarski S., Wymysłowski A., Erinc M., Gielen A. W. J.A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packagingMicroelectronics Reliability. 2012, vol. 52, nr 7, s. 1300-1305
2012Tesarski S., Wymysłowski A.Glass transition analysis of cross-linked polymers: numerical and mesoscale approachMolecular modeling and multiscaling issues for electronic material applications / Nancy Iwamoto, Matthew M. F. Yuen, Haibo Fan eds. New York [i in.] : Springer, cop. 2012. s. 213-230
2012Tesarski S., Wymysłowski A., Hölck O.Influence of conversion level on simulation results of crosslinked polymers13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 : proceedings of the conference, Cascais, Portugal, April 16-17-18, 2012. [Piscataway, NJ] : IEEE, cop. 2012. 7 s.
2012Swierczyński R., Wymysłowski A.Experimental and numerical analysis of heat dissipation in electronic devices for the efficient energy managementMicroelectronic materials and technologies. Vol. 1. Koszalin : Wydawnictwo Uczelniane Politechniki Koszalińskiej, 2012. s. 261-268
2012Jankowski K., Wymysłowski A., Chicot D.Experimental system for analysing the combined loading and failure modes of solder joints in electronic packaging13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 : proceedings of the conference, Cascais, Portugal, April 16-17-18, 2012. [Piscataway, NJ] : IEEE, cop. 2012. 5 s.
2012Matkowski P. K., Fałat T.Zastosowanie tomografii komputerowej do oceny jakości mikrostruktur elektronicznychElektronika (Warszawa). 2012, R. 53, nr 2, s. 48-51
2012Dąbrowski A., Matkowski P. K., Golonka L.Fatigue strength testing of LTCC and alumina ceramics bondsMaterials Science-Poland. 2012, vol. 30, nr 4, s. 329-334
2012Urbański K.Wybrane projekty koła naukowego MikroCpp - zastosowania systemu Android w elektroniceElektronika (Warszawa). 2012, R. 53, nr 2, s. 21-22
2012Allaf K. N.,Świerczyński R.Thermal energy harvester for battery-less sensor system10th Student's Science Conference Man - Civilization - Future : Wałbrzych, 12-15 July 2012. Wrocław : Oficyna Wydawnicza Politechniki Wrocławskiej, 2012. s. 9-14
2012Kłossowicz A., Winiarski P., Płatek B., Stęplewski W., Borecki J., Dziedzic A.Power dissipation from resistors embedded in printed circuit boardsProceedings of 2012 International Students and Young Scientists Workshop "Photonics and Microsystems" : international optoelectronics workshop, Szklarska Poręba, Poland, 6-8 July, 2012 / [eds. Jaroslaw Domaradzki, Michal Mazur, Kosma Baniewicz]. Wrocław : Oficyna Wydawnicza Politechniki Wrocławskiej, 2012. s. 57-62
2012Płatek B., Fałat T., Felba J.The Influence of the Manufacture Process on the Thermal Conductivity of Polymer Base Thermal Interface Materials Containing Carbon Nano TubesPLUS 10/2012, p.2268
2012Matkowski P., Brabandt I.Modal analysis of board vibration during mechanical reliability tests of lead-free solder joints4th Electronics System Integration Technologies Conference, Amsterdam, 2012
2012Fałat T, Felba J., Płatek B., Mościcki A., Smolarek A., Stojek K.Photonic sintering process of ink-jet printed conductive microstructures4th Electronics System Integration Technologies Conference, Amsterdam, 2012
2012Urbański K.J., Fałat T., Felba J., Mościcki A., Smolarek A., Bonfert D., Bock K.Experimental method for low-temperature sintering of nano-Ag inks using electrical excitation12th Nanotechnology Conference IEEE NANO 2012, Birmingham
2012Mościcki A., Fałat T., Smolarek A., Kinart A., Felba J., Borecki J.Interconnection process by ink jet printing method12th Nanotechnology Conference IEEE NANO 2012, Birmingham
2012Płatek B., Fałat T., Felba J.The Manufacture Process Influence on Thermal Conductivity of Polymers Thermal Interface Materials with Carbon Nanotubes35th Int. Spring Seminar on Electronics Technology, ISSE 2012, Bad Aussee
2012Fałat T., Płatek B., Felba J.Sintering Process of Silver Nanoparticles in Ink-Jet Printed Conductive Microstructures - Molecular Dynamics Approach13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, Lisbon
2011Allaf K. N.A battery-free wireless sensor platform powered with multiple energy sourcesCzłowiek - cywilizacja - przyszłość : IX Konferencja Naukowa Studentów, Będlewo, 7-9 października 2011. Wrocław : Oficyna Wydawnicza Politechniki Wrocławskiej, 2011. s. 7-12
2011Dowhań Ł., Wymysłowski A., Janus P., Ekwińska M., Wittler O.Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methodsMicroelectronics Reliability. 2011, vol. 51, nr 6, s. 1046-1053
2011Dowhań Ł., Wymysłowski A., Kaliciński S. Janus P.Numerical prototyping methods in microsystem accelerometers designMicroelectronics Reliability. 2011, vol. 51, nr 7, p. 1276-1282
2011Matkowski P.Acceleration factors of combined reliability tests of lead-free SnAgCu BGA interconnections18th European Microelectronics & Packing Conference, EMPC-2011 Brighton, 2011
2011Matkowski P.Reliability of SnAgCu solder joints during vibration in various temperature34th International Spring Seminar on Electronics Technology, ISSE 2011, Tatranská Lomnica
2011Matkowski P., Dudek R., Kreyssig K.Reliability testing of SnAgCu solder joints under combined loadingMicromaterials and Nanomaterials, 2011, iss. 13, p. 86-91
2011Smolarek A., Mościcki A., Kinart A., Felba J., Fałat T.Dependency of silver nanoparticles protective layers on sintering temperature of printed conductive structures 34th International Spring Seminar on Electronics Technology, ISSE 2011, Tatranská Lomnica
2011Płatek B., Fałat T., Felba J.An accurate method for thermal conductivity measurement of thermally conductive adhesives34th International Spring Seminar on Electronics Technology, ISSE 2011, Tatranská Lomnica
2011Mościcki A., Smolarek A., Felba J. Fałat T.Influence of different type protective layer on silver metallic nanoparticles for Ink-Jet printing technique18th European Microelectronics & Packing Conference, EMPC-2011 Brighton, 2011
2011Felba J.Inkjet printed electrically conductive structures for microelectronics34th International Spring Seminar on Electronics Technology, ISSE 2011, Tatranská Lomnica
2011Fałat T., Felba J., Płatek B., Piasecki T., Mościcki A., Smolarek A.Low-temperature, photonic approach to sintering the ink-jet printed conductive microstructures containing nano sized silver particles18th European Microelectronics & Packing Conference, EMPC-2011 Brighton, 2011
2011Falat T., Felba J., Moscicki A., Borecki J.Nano-silver Inkjet Printed Interconnections through the Microvias for Flexible Electronics11th Nanotechnology Conference IEEE NANO 2011, Portland USA, pp.473-477
2011Platek B., Urbański K., Falat T., Felba J.The Method of Carbon Nanotube Dispersing for Composites Used in Electronic Packaging11th Nanotechnology Conference IEEE NANO 2011, Portland USA, pp. 102-105
2011Falat T., Felba J., Matkowski P., Platek B., Demont P., Marcq F., Monfraix P., Moscicki A., Półtorak K.Electrical, Thermal and Mechanical Properties of Epoxy Composites with Hybrid Micro- and Nano- Sized Fillers for Electronic Packaging11th Nanotechnology Conference IEEE NANO 2011, Portland USA, pp.97-101
2011Dowhań Ł., Wymysłowski A., Janus P., Ekwińska M., Wittler O.Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methodsMicroelectronics Reliability 2011, vol. 51, nr 6, s. 1046-1053
2011Falat T., Felba J., Moscicki A., Borecki J.Nano-silver Inkjet Printed Interconnections through the Microvias for Flexible Electronics11th Nanotechnology Conference IEEE NANO 2011, Portland USA, pp.473-477
2011Platek B., Urbański K., Falat T., Felba J.The Method of Carbon Nanotube Dispersing for Composites Used in Electronic Packaging11th Nanotechnology Conference IEEE NANO 2011, Portland USA, pp. 102-105
2011Falat T., Felba J., Matkowski P., Platek B., Demont P., Marcq F., Monfraix P., Moscicki A., Półtorak K.Electrical, Thermal and Mechanical Properties of Epoxy Composites with Hybrid Micro- and Nano- Sized Fillers for Electronic Packaging11th Nanotechnology Conference IEEE NANO 2011, Portland USA, pp.97-101
2011Dowhań Ł., Wymysłowski A., Wittler O.Investigation of thin films by nanoindentation with DOE and numerical methods12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-systems, EuroSimE 2011, Linz
2011Tesarski S., Wymysłowski A., Hölck O.Assessment of thermo mechanical properties of crosslinked epoxy mesoscale approach - preliminary results12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-systems, EuroSimE 2011, Linz
2011Tesarski S., Wymysłowski A., Mavinkurve A., Gielen A.W. J.A multi-scale approach to the thermo-mechanical behaviour of silica-filled epoxies for electronic packaging12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-systems, EuroSimE 2011, Linz
2011Fałat T., Płatek B., Felba J.Non-equilibrium molecular dynamics simulation of heat transfer in carbon nanotubes - verification and model validation12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-systems, EuroSimE 2011, Linz
2011Płatek B., Fałat T., Felba J.The influence of molecular dynamics simulation parameters on the accuracy of carbon nanotubes thermal conductivity calculations12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-systems, EuroSimE 2011, Linz
2011Felba J.Thermally conductive adhesives in electronicsW: Advanced adhesives in electronics: materials, properties and applications / ed. by M. O. Alam and C. Bailey. Oxford, Woodhead Publishing, 2011. s. 15-52,
2011Marcq F., P. Demont P., Monfraix P., Peigney A., Laurent Ch., Falat T., Courtade F., Jamin T.Carbon nanotubes and silver flakes filled epoxy resin for new hybrid conductive adhesivesMicroelectronics Reliability 51 (2011) p. 1230-1234
2011Małecki K., Urbański K., Wymysłowski A.A novel experimental setup for accelerated reliability assesment of solder and adhesive jointsElektronika, Nr 3, 2011, s. 106-108
2011Falat T., Felba J., Matkowski P., Platek B., Demont P., Marcq F., Monfraix P., Moscicki A., Półtorak K.Electrical, Thermal and Mechanical Properties of Epoxy Composites with Hybrid Micro- and Nano- Sized Fillers for Electronic Packaging11th Nanotechnology Conference IEEE NANO 2011, Portland USA, pp.97-101
2011Platek B., Urbański K., Falat T., Felba J.The Method of Carbon Nanotube Dispersing for Composites Used in Electronic Packaging11th Nanotechnology Conference IEEE NANO 2011, Portland USA, pp. 102-105
2011Falat T., Felba J., Moscicki A., Borecki J.Nano-silver Inkjet Printed Interconnections through the Microvias for Flexible Electronics11th Nanotechnology Conference IEEE NANO 2011, Portland USA, pp.473-477
2011Fałat T., Felba J., Płatek B., Piasecki T., Mościcki A., Smolarek A.Low-temperature, photonic approach to sintering the ink-jet printed conductive microstructures containing nano sized silver particles18th European Microelectronics & Packing Conference, EMPC-2011 Brighton, 2011
2011Felba J.Inkjet printed electrically conductive structures for microelectronics34th International Spring Seminar on Electronics Technology, ISSE 2011, Tatranská Lomnica
2011Mościcki A., Smolarek A., Felba J., Fałat T.Influence of different type protective layer on silver metallic nanoparticles for Ink-Jet printing technique18th European Microelectronics & Packing Conference, EMPC-2011 Brighton, 2011
2011Płatek B., Fałat T., Felba J.An accurate method for thermal conductivity measurement of thermally conductive adhesives34th International Spring Seminar on Electronics Technology, ISSE 2011, Tatranská Lomnica
2011Smolarek A., Mościcki A., Kinart A., Felba J., Fałat T.Dependency of silver nanoparticles protective layers on sintering temperature of printed conductive structures34th International Spring Seminar on Electronics Technology, ISSE 2011, Tatranská Lomnica
2011Matkowski P., Dudek R., Kreyssig K.Reliability testing of SnAgCu solder joints under combined loadingMicromaterials and Nanomaterials, 2011, iss. 13, p. 86-91
2011Matkowski P.Reliability of SnAgCu solder joints during vibration in various temperature34th International Spring Seminar on Electronics Technology, ISSE 2011, Tatranská Lomnica
2011Matkowski P.Acceleration factors of combined reliability tests of lead-free SnAgCu BGA interconnections18th European Microelectronics & Packing Conference, EMPC-2011 Brighton, 2011
2011Dowhań Ł., Wymysłowski A., Kaliciński S. Janus P.Numerical prototyping methods in microsystem accelerometers designMicroelectronics Reliability. 2011, vol. 51, nr 7, p. 1276-1282
2011Dowhań Ł., Wymysłowski A., Janus P., Ekwińska M., Wittler O.Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methodsMicroelectronics Reliability. 2011, vol. 51, nr 6, s. 1046-1053.
2011Małecki K. Urbański K., Wymysłowski A.A novel experimental setup for accelerated reliability assesment of solder and adhesive jointsElektronika, 2011, R. 52, nr 3, s. 106-108.
2011Tesarski S., Wymysłowski A., Hölck O.Assessment of thermo mechanical properties of crosslinked epoxy mesoscale approach - preliminary results12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-systems, EuroSimE 2011 s.5
2011Weltevreden E., Muga E., Tesarski S., Wymysłowski A., Mavinkurve A., Gielen A.A multi-scale approach to the thermo-mechanical behaviour of silica-filled epoxies for electronic packaging12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-systems, EuroSimE 2011 s.4
2011Marcq F., Demont P., Monfraix P., Peigney A., Laurent Ch., Falat T., Courtade F., Jamin T.Carbon nanotubes and silver ?akes ?lled epoxy resin for new hybrid conductive adhesivesMicroelectronics Reliability 51 (2011) 1230-1234
2011Fałat T., Płatek B., Felba J.Non-Equilibrium Molecular Dynamics Simulation of Heat Transfer in Carbon Nanotubes - Verification and Model Validation 12th Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2011, Linz, Austria, 2011
2011Platek B., Falat T., Felba J.The influence of molecular dynamics simulation parameters on the accuracy of carbon nanotubes thermal conductivity calculations12th Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2011, Linz, Austria, 2011
2010Tesarski S., Wymysłowski A., Hölck O., Małecki K.Experimental validation of molecular modeling of crosslinked polymers applied in electronic packaging10th Electron Technology Conference ELTE 2010 and 34th International Microelectronics and Packaging IMAPS-CPMT Poland Conference s.3
2010Tesarski S., Wymysłowski A., Hölck O., Małecki K.Numerical and experimental assessment of moulding compounds thermo mechanical propertiesMicromaterials and Nanomaterials. 2010, iss. 12, s. 126-129
2010Urbański K., Płatek B., Fałat T., Felba J., Marcq F.Novel method for CNTs dispersion in fluids10th Electron Technology Conference ELTE 2010 and 34th International Microelectronics and Packaging IMAPS-CPMT Poland Conference, Wrocław, 22-25 September 2010
2010Grabiec P., Janus P., Janczyk G., Szynka J., Urbański K., Wymysłowski A., Camp O. op den, Battistig G., Weelden T. van der, Casselgren J., Schravendeel R., Thewissen H.Nanoelectronics for safe, fuel efficient and environment friendly automotive solutions - an ENIAC joint undertaking research project. W: Automotive meets electronics, AmE 2010Beiträge der GMM-Fachtagung, vom 15. - bis 16. April 2010, Dortmund. Berlin
2010Tesarski S., Hölck O., Płatek B., Wymysłowski A.Influence of meso-scale analysis parameters of cross-linked polymers on final simulation results 33rd International Spring Seminar on Electronics Technology, ISSE 2010, Warsaw, Poland, s. 408-411
2010Wiejak W., Wymysłowski A.Uproszczony analityczny model rozpraszania mocy w linii opóźniającej lampy fali bieżącejElektronika 2010, R. 51, nr 3, s. 114-119
2010Wymysłowski A., Dowhań Ł., Wittler O., Mrossko R., Dudek R.Application of nanoindentation technique to extraction of thin films properties through experimental and numerical analysisMaterials Science - Poland. 2010
2010Misiuk A., Bak-Misiuk J., Jung W., Felba J., Wierzchowski W., Wieteska K., Prujszczyk M.Revealing the defects in electron-irradiated Czochralski siliconRadiation Measurements, No 45 (2010) s.624-627.
2010Platek B., Falat T., Felba J., Borzdun A.The Study of Carbon Nanotube's Length in Reference to Its Thermal Conductivity by Molecular Dynamics Approach11th Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, s.4
2010Tesarski S.J., Hölck O., Wymysłowski A.Numerical Approach to Multiscale Evaluation and Analysis of Tg of Crosslinked Polymers11th Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, s.4
2010Dowhań Ł., Wymysłowski A., Wittler O., Mroßko R.Application of Numerical Optimization Algorithms Used to Investigation of Thin Films in Nanoindentation Test11th Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, s.5
2010Misiuk A., Jung W., Prujszczyk M., Bak-Misiuk J., Felba J.Ujawnienie historii radiacyjnej napromieniowanego elektronami krzemu otrzymanego metodą Czochralskiego poprzez po-radiacyjną obróbkę termicznąPrzegląd Elektrotechniczny. 2010, vol. 86, nr 7, s. 29-31
2010Falat T., Felba J., Moscicki A., Smolarek A., Bock K., Bonfert D.Influence of nano silver filler content on properties of ink-jet printed structures for microelectronics3rd Electronics Systemintegration Technology Conference, Berlin, 2010
2010Matkowski P., Felba J.Influence of solder joint constitution and aging process duration on reliability of lead-free solder joints under vibrations combined with thermal cycling3rd Electronics Systemintegration Technology Conference, Berlin, 2010
2010Platek B., Falat T., Felba J.The impact of carbon nanotubes diameter on their thermal conductivity - non-equilibrium molecular dynamics approach3rd Electronics Systemintegration Technology Conference, Berlin, 2010
2010Dowhań Ł., Wymysłowski A., Janus P., Ekwińska M., Wittler O.Application of Multi-criteria Optimization Algorithms to Numerical Material Extraction of Thin Layers Through Nanoindentaion Technique3rd Electronics Systemintegration Technology Conference, Berlin, 2010
2009Wiejak W., Wymysłowski A.Thermal analysis of TWT delay line by combined theoretical and numerical approach33rd International Conference of IMAPS - CPMT IEEE Poland, Pszczyna 2009, s. 359-362
2009Wymysłowski A., Wittler O., Mrossko R., Dudek R., Auersperg J., Dowhań Ł.Numerical approach to extraction of elasto-plastic material models and corresponding properties of thin layers trough nanoidentation technique International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, Delft, The Netherlands
2009Felba J., Nitsch K, Piasecki T., Tesarski S., Moscicki A., Kinart A., Bonfert D., Bock K.Properties of Conductive Microstructures Containing Nano Sized Silver Particles11th Electronics Packaging Technology Conference, Singapore 2009, s.879-883
2009Falat T., Platek B., Felba J.Molecular Dynamics Study of the Chiral Vector Influence on Thermal Conductivity of Carbon Nanotubes11th Electronics Packaging Technology Conference, Singapore 2009, s.636-639
2009Dowhań Ł., Wymysłowski A., Dudek R.Multi-objective decision support system in numerical reliability optimization of modern electronic packagingMicrosystem Technologies: Micro- and Nanosystems - Information Storage and Processing Systems, 2009, vol. 15, nr 12, s. 1777-1783.
2009Marenco N., Allegato G., Kostner H., Gal W., Conte A., Malecki K., Reinert W., Warnat S., Lange P., Gruenzig S., Hillmann S., Guadagnuolo S., Friedel K.Investigation of Key Technologies for System-In-Package Integration of Inertial MemsSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Rome, Italy
2009Malecki K., Falat T., Tarczkowska E., Bock G., Hillmann G., Sigl A., Marenco N., Friedel K.A Numerical Study on Optimization of Stresses Occurred During Chip to Wafer Bonding in VacuumIMAPS 5th International Conference and Exhibition on Device Packaging, Scottsdale/Fountain Hills, Arizona USA
2009Gal W., Wensink, Malecki K., Friedel K.Wafer level packaging by using transfer moldingSmart Systems Integration, European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components
2009Fałat T., Friedel K., Marenco N., Warnat S.TSV constraints related to temperature exursion, pressure during molding, materials used and handling loads. Microsystem TechnologiesMicro- and Nanosystems - Information Storage and Processing Systems. 2009, vol. 15, nr 1, s. 181-190
2009Fałat T., Friedel K., Małecki K., Uruska D., Gal W.The influence of process parameters and materials properties on stress distribution in MEMS - ASIC integrated systems after molding - numerical and experimental approachInternational Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, Delft, The Netherlands
2009Fałat T., Jansen Kaspar M. B., Vreugd J., Rzepka S.Influence of cure dependency of molding compound properties on warpage and stress distribution during and after the encapsulation of electronics componentsInternational Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, Delft, The Netherlands
2009Fałat T., Vreugd J., Jansen Kaspar M. B., Ernst L., Bohm C.Cure induced warpage of micro-electronics: comparison with experimentsInternational Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, Delft, The Netherlands
2009Dowhan L., Wymysłowski A., Urbanski K.Simulated Annealing as a Global Optimization Algorithm Used in Numerical Prototyping of Electronic PackagingInternational Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, Delft, The Netherlands
2009Platek B., Falat T., Felba J.The impact of the number of walls on CNTs thermal conductivity - molecular dynamics approach33rd International Conference of IMAPS - CPMT IEEE Poland, Pszczyna 2009, s. 285-290
2009Matkowski P., Zawierta R., Urbański K., Felba J.Stability of Solder Joint Resistance After Multiple Aging Processes. Repeatable Multiple Measurements of Solder Joint Resistance33rd International Conference of IMAPS - CPMT IEEE Poland, Pszczyna 2009, s. 255-260
2009Matkowski P., Małecki Ł., Bober B., Felba J.Resistance changes of lead-free solder joints induced by defects of their structure33rd International Conference of IMAPS - CPMT IEEE Poland, Pszczyna 2009, s. 251-254
2009Matkowski P., Obajtek P., Bober B., Felba J.Influence of soldering and aging processes on the structure of lead-free solder joints33rd International Conference of IMAPS - CPMT IEEE Poland, Pszczyna 2009, s. 247-250
2009Karolczyk J., Kozłowski M., Wymysłowski A.Application of semantic network tools at prototyping stage of electronic packaging33rd International Conference of IMAPS - CPMT IEEE Poland, Pszczyna 2009, s. 171-174
2009Wymysłowski A.Application of thermo-mechanical numerical prototyping in electronic33rd International Conference of IMAPS - CPMT IEEE Poland, Pszczyna 2009, s. 44-49
2009Felba J., Nitsch K., Piasecki T., Paluch P. Moscicki A., Kinart A.The Influence of Thermal Process on Electrical Conductivity of Microstructures Made by Ink-Jet Printing with the Use of Ink Containing Nano Sized Silver Particles9th IEEE Conference on Nanotechnology, Genoa 2009, s. 494-497
2009Borecki J., Felba J., Wymysłowski A.Analysis of blind microvias forming process in multilayer printed circuit boardsMateriały Elektroniczne, T.37, Nr 1. 2009, s.59-72
2009Falat T., Platek B., Tesarski S., Felba J.An Approach to Measurement and Evaluation of the Thermal Conductivity of the Thermal Adhesives in Electronic Packaging32nd International Spring Seminar on Electronics Technology, Brno 2009
2009Matkowski P., Zawierta R., Felba J.Vibration Response of Printed Circuit Board in Wide Range of Temperature. Characterization of PCB Materials32nd International Spring Seminar on Electronics Technology, Brno 2009
2009Wymysłowski A., Dowhań Ł., Felba J., Wittler O., Mrossko R., Dudek R., Michel B.Combined numerical and experimental approach for extraction of elasto-plastic material properties in case of thin layersMicromaterials and Nanomaterials, 2009, No. 9, s. 128-132
2009Dowhań Ł., Wymysłowski A., Felba J., Dudek R., Auersperg J., Michel B.Application of multi-criteria optimization to stacked packagingMicromaterials and Nanomaterials 2009 No 9, s. 120-125
2008Dowhań Ł., Wymysłowski A., Dudek R.An approach of numerical multi-objective optimization in stacked packagingMicroelectronics Reliability. 2008, vol. 48, nr 6, s. 851-857
2008Malecki K., Pikur L., Falat T., Bock G., Hillmann G., Sigl A., Marenco N., Friedel K.A Numerical Study on Heat Flow and Load Distribution during Chip to Wafer or Wafer to Wafer Bonding in VacuumEPTC 2008, 10th Electronics Packaging Technology Conference, Singapore, pp.18-23
2008Marenco N., Reinert W., Warnat S., Lange P., Gruenzig S., Hillmann G., Kostner H., Bock G., Guadagnuolo S., Conte A., Friedel K., Malecki K.Vacuum Encapsulation of Resonant MEMS Sensors by Direct Chip-to-Wafer Stacking on ASICEPTC 2008, 10th Electronics Packaging Technology Conference, Singapore, pp.773-777
2008Marenco N., Reinert W., Warnat S., Lange P., Allegato G., Ungaretti T., Hillmann G., Bock G., Gal W., Guadagnuolo S., Conte A., Friedel K., Malecki K., Falat T.Reliability and Test Challenges around C2W and W2W SiP assembliesSymposium 2008 Reliability and DfX Engineering Workshop, Pallanza, Lago Maggiore, Italy
2008Dowhań Ł., Wymysłowski A., Felba J., Dudek R.The polymer materials as the essential input parameters in numerical multi-objective optimization of stacked packagingThe 7th IEEE Conference on Polymers & Adhesives in Microelectronics and Photonics, Polytronic 2008, Garmisch-Partenkirchen
2008Tesarski S., Urbański K., Płatek B.An Analysis of VOC-free fluxes and lead-free solders application in a manual SMD soldering2008 International Students and Young Scientists Workshop Photonics and Microsystems(http://ieeexplore.ieee.org)
2008Płatek B., Tesarski S.Susceptibility of solder masks on solderballing and webbing in wave soldering2008 International Students and Young Scientists Workshop Photonics and Microsystems(http://ieeexplore.ieee.org)
2008Zawierta R., Urbański K., Matkowski P.A fast recorder for changes of a resistance during joint failure in electronics2008 International Students and Young Scientists Workshop Photonics and Microsystems(http://ieeexplore.ieee.org)
2008Matkowski P., Friedel K.Management of Waste Electrical and Electronic Equipment in Poland - ecological, organizing and economical aspects2008 International Students and Young Scientists Workshop Photonics and Microsystems(http://ieeexplore.ieee.org)
2008Matkowski P.Treatment of waste electrical and electronic equipment. Technologies of disassembly, recycling stagesProgress in eco-electronics. Eds Krystyna Bukat, Józef Gromek, Marek Gonera. Warsaw : Tele & Radio Res. Inst., 2008. s. 143-147
2008Matkowski P., Friedel K., Felba J.Organizacja systemu gospodarowania zużytym sprzętem elektrycznym i elektronicznym w PolscePolski Kongres Logistyczny LOGISTICS 2008. Nowe wyzwania - nowe rozwiązania., Poznań, 7-9 maja 2008. Poznań : Instytut Logistyki i Magazynowania, s. 109-123, 1 rys., 2 tab., bibliogr. 13 poz.
2008Matkowski P., Wymysłowski A., Felba J.Molecular modeling as a novel and promising numerical tool in microelectronics packagingElectron Technology - Internet Journal 2005/2006 vol. 37/38, nr 14, s. 1-6, 8 (http://www.ite.waw.pl/etij/)
2008Matkowski P., Friedel K., Felba J.Treatment of Waste Electrical and Electronic Equipment. Technologies of Disassembling, Recycling StagesMonographies of Tele & Radio Research, Warszawa 2008, p.143-147
2008Matkowski P., Friedel K., Felba J.System of Waste Electrical and Electronic Equipment Management - Potential Directions of Development in a-few year perspectiveMonographies of Tele & Radio Research, Warszawa 2008, p.178-184
2008Felba J.Nanomaterials and Technologies for Conductive Miscrostructures31st International Spring Seminar on Electronics Technology, Budapest 2008, p.207-212
2008Małecki K., Bock G., Hllmann G., Friedel K.Thermo-Mechanical Modelling of Chip to Wafer Hermetic Vacuum Bonding ProcessSmart System Integration, 2nd European Conference & Exhibition, Barcelona 2008, p 489-491
2008Dowhań Ł., Wymysłowski A., Dudek R.An approach of numerical multi-objective optimization in stacked packagingMicroelectronics and Reliability. 2008 vol. 48, nr 6, s. 851-857, 11 rys., 2 tab., bibliogr. 7 poz.
2008Matkowski P., Urbański K., Fałat T., Felba J., Żaluk Z., Zwierta R., Dasgupta A., Pecht M.Application of FPGA units in combined temperature cycle and vibration reliability tests of lead-free interconnections2nd Electronics Systemintegration Technology Conference, London-Greenwich, 2008, p.1375-1379
2008Zawierta R., Matkowski P., Urbanski K., Felba J.Data Visualization in a Fast Data Acquisition System for Long-term Reliability Tests of Microelectronic Interconnections2nd Electronics Systemintegration Technology Conference, London-Greenwich, 2008, p.481-484
2008Dowhań Ł., Wymysłowski A., Felba J., Wiese S., Wolter K.J.Application of genetic algorithm in numerical multi-objective optimization of ceramic capacitors2nd Electronics Systemintegration Technology Conference. [ESTC] 2008. Proceedings, Greenwich, UK, [1st-4th September] 2008. Vol. 1. Piscataway, NJ : IEEE, cop. 2008. s. 377-382, 14 rys., 1 tab., bibliogr. 6 poz.
2008Wymysłowski A., Wittler O., Mrossko R., Dudek R.Application of nanoindentation technique in microelectronics32nd International IMAPS-IEEE CPMT Poland Conference, Warszawa-Pułtusk, 21-24 September 2008. Warszawa : Oficyna Wydaw. PWarsz., [2008. 5] s., 14 rys., bibliogr. 5 poz.
2008Borecki J., Felba J., Wymysłowski A.Analysis of blind microvias forming process in multilayer printed circuit boards32nd International IMAPS-IEEE CPMT Poland Conference, Warszawa-Pułtusk, 21-24 September 2008. Warszawa : Oficyna Wydaw. PWarsz., [2008. 6] s., 8 rys., 10 tab., bibliogr. 2 poz.
2008Wymysłowski A., Bober B., Dowhań Ł., Fałat T., Felba J., Małecki K., Matkowski P., Urbański K., Zawierta R., Żaluk Z.Numerical and experimental approach to strength assessment of solder and adhesive joints by shearing test32nd International IMAPS-IEEE CPMT Poland Conference, Warszawa-Pułtusk, 21-24 September 2008. Warszawa : Oficyna Wydaw. PWarsz., [2008. 4] s., 7 rys., 2 tab., bibliogr. 5 poz.
2008Falat T., Friedel K., Marenco N., Warnat S.TSV constraints related to temperature excursion, pressure during molding, materials used and handling loadsMicrosystem Technologies, 2009 vol.15, no 1, pp 181-190
2008Fałat T., Wymysłowski A., Kolbe J., Jansen K.M.B., Ernst L.Influence of matrix viscoelastic properties on thermal conductivity of TCA-numerical approachMicroelectronics and Reliability, 2007 vol. 47, no 12, pp. 1989-1996
2008Tesarski S., Płatek B.Topniki wodne w kontekście zielonej elektronikiVI Konferencja Naukowa Studentów KNS 2008 materiały konferencyjne
2007Borecki J., Wymysłowski A.Numerical modeling of electrical resistance of interconnections in High-Tech multilayer PCBs manufactured by magnetron sputtering deposition of copperProceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. EuroSimE 2007, London, April 16-17-18, 2007 / Ed. by L. J. Ernst [i in.]. Piscataway, NJ : IEEE, cop. 2007. s. 487-492, 15 rys., 1 tab., bibliogr. 8 poz.
2007Dowhań Ł., Wymysłowski A., Dudek R.Multi-objective parametric approach to numerical optimization of stacked packagesProceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. EuroSimE 2007, London, April 16-17-18, 2007 / Ed. by L. J. Ernst [i in.]. Piscataway, NJ : IEEE, cop. 2007. s. 637-643, 11 rys., 2 tab., bibliogr. 5 poz.
2007Kisiel R., Felba J., Borecki J., Fałat T., Mościcki A.Kompozycje elektrycznie przewodzące w produkcji płytek drukowanychElektronika Nr 6, 2007, p.31
2007Wymysłowski A., Bober B., Dowhań Ł., Fałat T., Felba J., Małecki K., Matkowski P., Urbański K., Żaluk Z.Shearing test for solder joint reliability assessment 31st International Conference of International Microelectronics and Packaging Society - Poland Chapter, Rzeszów-Krasiczyn 2007, p.275-278
2007Felba J., Fałat T., Wymysłowski A.Influence of thermo-mechanical properties of polimer matrics on the thermal conductivity of adhesives for microelectronic packagingMaterials Science-Poland, Vol.25, No.1, 2007, p.45-55
2007Bober B., Bochenek A., Olszewska-Mateja B., Żaluk Z.Z.Investigation of mechanical strength and electrical resistance of adhesives and adhesive joints in liquid nitrogenMicroelectronics International, Vol.25, No 1, 2007, p.49-53
2007Fałat T., Wymysłowski A., Kolbe J.Numerical approach to characterization of thermally conductive adhesivesMicroelectronics Reliability 47 (2007) p.342-346
2007Kisiel R., Felba J., Borecki J., Mościcki A.Problems of PCB microvias filling by conductive pasteMicroelectronics Reliability 47 (2007) p.335-341
2007Wymysłowski A., van Driel W.D., van de Peer J., Tzannetakis N., Zhang G.O.Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliabilityMicroelectronics Reliability 47 (2007) p.280-289
2007Mościcki A., Felba J., Gwiaździński P., Puchalski M.Conductivity improvement of microstructures made by nano-size-silver filled formulations6th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Tokyo 2007, p.305-310
2007Falat T., Felba J.Numerical Prediction of Influence Matrix and Filler Properties on Thermal Conductivity of Copper Filled TCA6th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Tokyo 2007, p.114-118
2007Felba J., Fałat T.Thermally Conductive Adhesives for Microelectronics - Barriers of Heat Transport6th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Tokyo 2007, p.228-233
2006Friedel K., Matkowski P., Felba J.Uproszczona ocena cyklu życia złączy wykonanych przy zastosowaniu bezołowiowych stopów lutowniczych oraz klejów elektrycznie przewodzącychPr. Przem. Inst. Elektron. 2006 R. 47 nr 153 s.84-94
2006Matkowski P., Wymysłowski A., Felba J.Application of molecular modeling as a novel and promising numerical tool in microelectronics30th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Kraków 2006, p.509-616
2006Kowalczyk M., Stonoga J., Matejko R., Urbański K., Fałat T., Paluszyński J., Licznerski B.Universal controlling, data storage and visualization system30th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Kraków 2006, p.505-508
2006Kisiel R., Borecki J., Felba J., Mościcki A.Climatic testing of PCB interconnections made by electrical conductive adhesives30th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Kraków 2006, p.335-338
2006Dowhań Ł., Wymysłowski A., Dudek R., Auersperg J.Numerical Approach to Optimization of Stacked Packages30th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Kraków 2006, p.283-288
2006Fałat T. Felba J.Conductivity improvement of electrically conductive adhesives by thermal post-curing process30th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Kraków 2006, p.301-306
2006Dowhań Ł., Wymysłowski A., Dudek R., Auersperg J.Paramertric Approach to Numerical Design for Optimization of Stacked Packages1st Electronics Systemintegration Technology Conference, Dresden 2006, p.1194-1202
2006Fałat T., Felba J., Wymysłowski A., Jansen K.M.B. Nakka J.S.Viscoelestic characterization of Polymer Matrix of Thermal Conductive Adhesives1st Electronics Systemintegration Technology Conference, Dresden 2006, p.773-781
2006Borecki J., Felba J., Gromek J. Posadowski W.M.Interconnections in Multilayer PCBs based on Microvias Metallized by Magnetron Sputtering Deposition1st Electronics Systemintegration Technology Conference, Dresden 2006, p.525-531
2006Mościcki A., Felba J. Dudziński W.Conductive Microstructures and Connections for Microelectronics Made by Ink-Jet Technology1st Electronics Systemintegration Technology Conference, Dresden 2006, p.511-517
2006Borecki J., Felba J., Posadowski W.Quality of PCB interconnections based on blind microvias metallized by magnetron sputtering deposition29th International Spring Seminar on Electronics Technology ISSE 2006. Proceedings, St. Marienthal 2006
2006Jung W., Misiuk A., Felba J., Megela L.G., Azhiniuk Yu., Prujszczyk M.Electrical Properties of Electron - Irradiated Cz-Si after Processing under Enhanced Hydroststic Pressure8th Int. Conf. on Electron Beam Technologies, Varna 2006, Electrotechnica & Electronica 5-6/2006, p.161-169
2006Fałat T, Felba J.Electron Beam as a Heat Source in Thermal Diffusivity Measurement of Thermally Conductive Adhesives8th Int. Conf. on Electron Beam Technologies, Varna 2006, Electrotechnica & Electronica 5-6/2006, p.189-193
2006Wiatrowski A., Posadowski W.M., Kulakowska-Pawlak B., Brudnik A., Felba J.Optical Emission Spectroscopy Studies of DC and Medium Frequency Magnetron Sputtering Discharges8th Int. Conf. on Electron Beam Technologies, Varna 2006, Electrotechnica & Electronica 5-6/2006, p.161-169
2006Kisiel R., Felba J., Borecki J., Mo?cicki A.Stability Properties of PCB Microvias Fillings made by Conductive Adhesives4th European Microelectronics and Packaging Symposium EMPS 2006
2005Wymysłowski A., Urbański K., Berlicki T.Numerical simulation and optimisation of the vacuum microsensor6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. EuroSimE, Berlin 2005, p.576-583
2005Matkowski P., Sakowicz M., Wymysłowski A., Felba J., Ambroziak A.Accelerated Tin Whisker Growth. Identification of Significant Factors for Design of Experiment29th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Koszalin-Darłówko 2005, p.103-106
2005Kisiel R., Felba J.Ekologiczna elektronika - uwarunkowania materiaowe i technologiczneElektronika rok XLVI nr 12/2005 str. 75-77
2005Kisiel R., Borecki J., Koziol G., Felba J.Conductive adhesives for through holes and blind vias metallizationMicroelectronics Reliability 45 (2005) p.1935-1940
2005Borecki J. Felba J., Posadowski W.Magnetron Sputtering Deposition of Copper on Polymers in High Density Interconnection PCBs5th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Wroclaw 2005, p.192-196
2005Falat T., Wymysłowski A., Kolbe J.Numerical Approach to Characterization of Thermally Conductive Adhesives5th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Wroclaw 2005, 180- 184
2005Qi H., Ganesan S., Wu Ji, Pecht M. Matkowski P., Felba J.Effects of Printed Circuit Board Materials on Lead-free Interconnect Durability5th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Wroclaw 2005, p.140-144
2005Kisiel R., Felba J., Borecki J., Moscicki M.,Problems of PCB Microvias Filling by Conductive Paste5th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Wroclaw 2005, p.96-101
2005Mościcki A., Felba J., Sobierajski T., Kudzia J., Arp A., Meyer W.Electrically Conductive Formulations Filled Nano Size Silver Filler for Ink-Jet Technology5th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Wroclaw 2005, p.40-44
2005Lachowicz M., Dudzinski W., Felba J., Haimann K.Analiza mikrostruktury warstw przetopionych wiazk elektronow w stopie inconel 713CInz. Mater. 26 nr 5, 2005, s.314-316
2005Fałat T., Felba J., Matkowski P., Urbański K., Zaluk Z.Combined System for Testing of Joints in Microelectronic Packaging Under Thermal Cycling, Humidity and Vibration Loading29th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Koszalin-Darłówko 2005, p.235-238
2005Matkowski P., Haiyu Q.Vibration test utilization in the study of reliability of connections in microelectronics2005 International Students and Young Scientists Workshop Photonics and Microelectronics
2005Kisiel R., Mo?cicki A., Felba J., Borecki J.Technological Aspects of Applying Adhesives in Small Diameter Vias29th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Koszalin-Darłówko 2005, p.99-102
2005Mościcki A., Felba J., Sobierajski T., Kudzia J.Snap Curing Electrically Conductive Adhesive Formulation for Solder Replacement ApplicationsJournal of Electronic Packaging, Vol.127, No 2, 2005, p.91-95
2005Urbański K., Fałat T., Felba J., Ganesan S., Pecht M.A novel test data-acquisition system for vibration testing of printed circuit board assemblies15th European Microelectronics and Packaging Conference & Exhibition, Brugge 2005, p.178-183
2005Ganesan S., Kim G., Wu J., Pecht M., Lee R., Lo J., Fu Y., Li Y., Xu M., Felba J.Solder Joint Defects of PBGs after Lead-free Assembly15th European Microelectronics and Packaging Conference & Exhibition, Brugge 2005, p.63-68
2005Wymysłowski A., Santo-Zarnik M., Belavic DSequential approach to numerical optimization of the LTCC ceramic pressure sensor6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. EuroSimE, Berlin 2005, p.376-383
2005Kisiel R., Borecki J., Felba J., Mościcki A.Electrically Conductive Adhesives as Vias Fill in PCBs: the influence of fill shape and contact metallization on vias resistance stability28th International Spring Seminar on Electronics Technology, Wiener Neustadt 2005, p.193-198
2005Wymysłowski A., van Driel W., Zhang G., van de Peer J., Tzannetakis N.Smart and sequential approach to numerical prototyping in micro-electronic applicationsJ. Microelectron. Electron. Packag. 2005, vol. 2 nr 1 p.1-7
2005Dora J.,Felba J., Sielanko W.A new generation of power supplies for electron beam welding machinesVacuum 77 (2005) 463-467
2005Wymysłowski A., Santo-Zarnik M., Belavic DTolerance Design of the LTCC Ceramic Pressure Sensor Sensivity29th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Koszalin-Darłówko 2005
2005Ganesan S., Kim G. Wu Ji, Pecht M., Felba J.Lead-free Assembly Defects in Plastic Ball Grid Array Packages5th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Wroclaw 2005, p.219-223
2005Bochenek A., Bober B., Olszewska-Mateja B., Żaluk Z.Mechanical strength and electrical resistance tests of adhesive joints particularly useful in low temperaturesXXIX International Conference of International Microelectronics and Packaging Society Poland Chapter. Proceedings. Koszalin-Darwko, 18-21 September 2005. p.87-90,
2004Santo-Zarnik M. Belavic D., Wymysłowski A., Friedel K.A numerical analysis of the piezoresistive properties of thick-film resistors in pressure-sensor applications3rd European Microelectronics and Packaging Symposium, Prague 2004, p.601-606
2004Olszewska K., Friedel K.Control of the electron beam active zone position in electron beam welding processesVacuum 2004 vol. 74 nr 1 p.29-43
2004Friedel K.Krytyczny przegląd bezołowiowych stopów lutowniczychIII Krajowa Konferencja Naukowo ? Techniczna Ekologia w Elektronice, Warszawa 2004, p.40-48
2004Wymysłowski A., Santo-Zarnik M., Friedel K., Belavic D.Numerical Simulation and Experimental Verification of the Piezoresistivity Phenomenon for the Printed Thick-Film Piezoresistors5th International Conference on Thermal and Mechanical Simulation and Experipments in Microelectronics and Microsystems, Brussels 2004, p.359-366
2004Ambroziak A., Felba J., Kisiel R.Luty bezołowiowe dla elektronikiPrzegl?d spawalnictwa nr 8-9/2004, p.101-104
2004Wymysłowski A., van Driel W.D., Zgang G.Q., van der Peer J., Tzannatakis N.Smart and Sequential Approavch to Numerical Prototyping in micro-Electronic Applications28th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Wrocław 2004, p.421-425
2004Fałat T., Felba J., Wymysłowski A.Improved Method for Thermal Conductivity Measurement of Polymer Based Materials for Electronic Packaging28th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Wrocław 2004, p.219-222
2004Borecki J., Kozioł G., Felba J., Kisiel R.Conductive Adhesives for Trough Holes and Blind Vias Metallization28th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Wrocław 2004, p.175-178
2004Wójcicki S., Sielanko W., Czopik A., Pilarczyk J., Banasik M., Felba J., Dora JElectron Beam Welding in Poland Current Status and Development Perspectives
2004Santo-Zarnik M., Belavic D., Friedel K., Wymysowski A.A procedure for validating the finite element model of a piezoresistive ceramic pressure sensorIEEE Trans. Compon. Packag. Technol. 2004, vol. 27 nr 4 p.668-675
2004van Driel W.D., van de Peer J., Tzannetakis N., Wymysłowski A., Zhang G.QAdvanced Numerical Prototyping Methods in Modern Engineering Applications5th International Conference on Thermal and Mechanical Simulation and Experipments in Microelectronics and Microsystems, Brussels 2004, p.211-218
2004Kisiel R., Felba J.Ecological Electronic Equipment Assembly - Materials and Technological AspectsVII Electron Technology Conference, Stare Jabłonki 2004, p.53-54
2004Friedel K.Design for reuse and recycling of electronic circuitsGlobal Symposium on Recycling, Waste Treatment and Clean Technology. REWAS '04. Ed. by I. Gaballah, Madrid, 2004. Vol. 3. p.2843-2844
2004Fałat T., Felba J.Kleje elektrycznie przewodzące jako alternatywa dla lutów cynowo-ołowiowychIII Krajowa Konferencja Naukowo-Techniczna Ekologia w Elektronice, Warszawa 2004, p.58-66
2004Kisiel R., Borecki J., Felba J., Mościcki A.Technological Aspects of Applaying Conductive Adhesives for Inner Connections in PCB4th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Portland 2004, AP32
2004Borecki J., Felba J., Posadowski W.M., Wojtalik K.Magnetron Sputtering Technology for Microvias Metallization28th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Wrocław 2004, p.171-174
2004Bochenek A.j, Bober B., Olszewska-Mateja B., Żaluk Z.Wpływ domieszek Cu w drucie złotym oraz metalizacji aluminiowej na stabilność połączeń w ukadach elektronicznych i systemach sensorowych. W: Czujniki optoelektroniczne i elektroniczne.COE 2004. VIII Konferencja naukowa. Materiay konferencyjne. Wrocaw, 27-30 czerwca 2004. p.77-81
2004Bochenek A., Bober B., Hauffe W., Łukaszewicz M., Langer E.,Thermal degradation of joined thick Au and Al elements.Microelectronics International. 2004 vol. 21 nr 1 p.31-34
2004Felba J., Mościcki A., Bereski M.Anisotropic Effect when Using Isotropic Conductive Adhesives4th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Portland 2004, MP22
2004Friedel K.Technologia lutowania spoiwami bezołowiowymiIII Krajowa Konferencja Naukowo-Techniczna Ekologia w Elektronice, Warszawa 2004, p.49-57
2004Friedel K.Krytyczny przegląd bezołowiowych stopów lutowniczychIII Krajowa Konferencja Naukowo-Techniczna Ekologia w Elektronice, Warszawa 2004, p.40-48
2004Wymysłowski A.,Fałat T.,Friedel K.,Felba J.Numerical simulation and experimental verification of the thermal contact properties of the polymers bonds5th International Conference on Thermal and Mechanical Simulation and Experipments in Microelectronics and Microsystems, Brussels 2004, p.177-183
2003Wymysłowski A., Friedel K., Felba J., Fałat T.An experimental-numerical approach to thermal contact resistance9th International Workshop on Thermal Investigations of ICs and Systems, Aix-en-Provence, 2003, p.161-172
2003Santo-Zarnik M., Friedel K., Wymysłowski A., Belavic D.Experimental verification of the finite-element model of a thick-film ceramic pressure sensor4th International Conference on Thermal & Mechanical Simulation and Experiments in Microelectronics and Microsystems. ESIME 2003 Aix-en-Provence, p.305-311
2003Fałat T., Felba J., Friedel K., Wymysłowski A.Simulation based approach to thermal contact properties assessment in modern electronic packages10th Int. Conf. Mixed Design of Integrated Circuits and Systems, ŁódĄ 2003, p.361-366
2003Felba J.Application of Polymers for Microelectronic PackagingProceedings of the m2ns2003 Workshop on Migration from Micro to Nano Sensors & Systems, Krefeld 2003, p.9-13
2003Bock K., Aschenbrenner R., Felba J.Polymer Electronics - fancy or the future of electronics27th International Conference and Exhibition of the International Microelectronics and Packaging Society - Poland, Podlesice 2003, p.57-62
2003Bochenek A., Bober B., Olszewska-Mateja B., Żaluk Z.Evaluation of silver alloys for thermosonic assembly of microelectronics circuits27th International Conference and Exhibition IMAPS - Poland 2003. Proceedings. Podlesice-Gliwice, 16-19 September 2003. p.118-121
2003Belavic D., Degen A., Dziedzic A., Friedel P.K., Golonka L., Hrovat M., Kita J., Santo-Zarnik M., Wymysłowski A.Investigations of Materials and modeling of sensitivity of thick-film resistors on different substrates for strain-gauge applications14th European Microelectronics and Packaging Conf. & Exhibition, Friedrichshafen 2003, p.448-452
2003Mościcki A., Felba J., Sobierajski T., Kudzia J.Snap curing electrically conductive formulation for solder replacement applications3rd International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Montreux, 2003, p.157-162
2003Friedel K., Wymysłowski A.An approach to numerical simulation of thermal contact problems in modern electronic packages4th International Conference on Thermal & Mechanical Simulation and Experiments in Microelectronics and Microsystems. ESIME 2003 Aix-en-Provence, p.183-189
2002Wymysłowski A.Reliability Prediction of the Solid Joints in Electronic PackagesEuropean Microelectronics Packaging and Interconnections Symposium, Cracow 2002, p.375-381
2002Felba J.Electrical Properties of Adhesive JointsEuropean Microelectronics Packaging and Interconnections Symposium, Cracow 2002, p.6-11
2002Felba J., Friedel K., Guenthner B., Mościcki A., Schäfer H.,The Influence of Filler Particle Shapes on Adhesive Joints in Microwave Applications2nd International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Zalaegerszeg, 2002, p.1-6
2002Friedel K.Zaawansowane technologie w montażu aparatury elektronicznejElektronika 2002, vol.43 nr 7/8, p.25-27
2002Sielanko W., Czopik A., Felba J., Jędrzejczyk M.Specjalistyczna spawarka elektronowa do wykonywania obwodowych spoin tłumików drgań skrętnychElektronika Nr 12, vol.XLIII, 2002. p.36-39
2002Miedziński B., Friedel K., Grodziński A., Wiśniewski G.Performance of pure nickel as a contact material under inductive load DC50th Relay Conference NARM 2002, Newport Beach, California, p.2-5
2002Belavic D., Friedel K.P., Wymysłowski A., Santo-Zarnik MVirtual Thermo-Mechanical Prototyping of the Ceramic Pressure SensorEuropean Microelectronics Packaging and Interconnections Symposium, Cracow 2002, p.369-374
2002Bochenek A., Bober B.Evaluation of soldering properties of silver conductor pads on LTCC structures using selected lead-free soldersEuropean Microelectronics Packaging & Interconnection Symposium. IMAPS - Europe Cracow 2002. Proceedings. Cracow, 16-18 June 2002 . p.125-129
2002Bochenek A., Bober B., Olszewska-Mateja B., Żaluk Z.Investigations of the influence of Au-alloy additives on diminishing Au-Al joints degradation. European Microelectronics Packaging & Interconnection SymposiumIMAPS - Europe Cracow 2002. Proceedings. Cracow, 16-18 June 2002. p.390-394
2002Belavic D., Friedel K.P., Wymysłowski A., Santo-Zarnik MVirtual Prototyping of the Ceramic Pressure SensorProceedings of the 3nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)- Electronics, Paris, 2002, pp.38-44
2001Friedel K. Kisiel R.Finite-element modeling: strain & stress distribution in adhesive bonded joints of 1206 chip components on FR-4 substrates13th European Microelectronics and Packaging Conference, Strasburg 2001, p.382 -387
2001Dziduszko J., Wymysłowski A., Friedel K.Numerical Method of Reliability Assessment of the Flip Chip PackagingBenefiting from Thermal and Mechanical Simulation in (Micro)-Electronics, 2nd International Conference, Paris, 9-11 April 2001, p.263-267
2001Belavic D., Friedel K., Santo-Zarnik M., Hrovat M.A design and simulate approach to improving the characteristics of ceramic pressure sensorsMIDEM Conference, Bohinj - Slovenia, 2001, pp.267-272
2001Felba J., Friedel K.Electrical Conduction of Adhesive Joints in Microwave Applications1st International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Potsdam 2001, p.71-78
2001Felba J., Friedel K.Zastosowanie klejów w montażu aparatury elektronicznejElektronika Nr 10, vol.XLII, 2001, p.55-58
2001Felba J., Friedel K.P., Krull P., Pobol I.L., Wohlfahrt H.Electron beam active brazing of cubic boron nitride to tungsten carbide cutting toolsVacuum No 62, 2001, p.171-180
2001Wymysłowski A.Probabilistic Approach to Numerical Reliability Assessment of Microelectronic ComponentsBenefiting from Thermal and Mechanical Simulation in (Micro)-Electronics, 2nd International Conference, Paris, 9-11 April 2001, p.67-73
2001Bochenek A., Bober B., Dziedzic A., Golonka L.Investigations of assembly properties of conductive layers in LTCC circuitsMicroelectronics International. 2001 vol. 18 nr 2 p.11-15
2001Felba J., Friedel K., Kisiel R., Mościcki R.The Influence of Solver Filler Concentration in Epoxy Adhesives on Electrical and Mechanical Properties of Adhesive Joints25th International Conference and Exhibition of the International Microelectronics and Packaging Society - Poland, Rzeszów - Pola?czyk 2001, p.67-70
2000Krull P., Decker I., Maul Ch., Overrath J., Nitschke-Pagel T., Wohlfahrt H., Felba J., Friedel K.P.Ein kontatloses Temperaturmesssystem zur Steuerung der Wärweeinbringung bei Elekronnenstrahlprozessen im VakuumSchweissen & Schneiden, 52, No.3, 2000, s.159-164
2000Wymysłowski A.Numerical simulation and assesment of different piezoresistive silicon pressure sensor configurationsMixed design of integrated circuits and systems. MIXDES 2000
2000Felba J., Friedel K., Kisiel R.The Future Alternatives of Tin-Lead PCB Assembly24rd Conference of the International Microelectronics and Packaging Society - Poland Chapter, Rytro 2000, p.27-40
2000Felba J., Friedel K.P., Kisiel R., Laska W., Mościcki A.Solder replacement with electrically conductive adhesives in microwave applicationsEuropean Microelectronics Packaging and Interconnection Symposium, Prague 2000, s.416-421
2000Wymysłowski A.Ocena dokładności modelowania numerycznego na przykładzie piezorezystancyjnego krzemowego czujnika ciśnieniaVI Konferencja Naukowa Czujniki optoelektroniczne i elektroniczne, Gliwice 2000, t.II, s.462-467
2000Felba J., Kisiel R., Mościcki A.Mechanical properties of Electrically Conductive Adhesives in PCB Assembly23rd International Spring Seminar on Electronics Technology, Balatonfüred 2000, s.180-184
2000Felba J., Friedel K., Mościcki A.Characterization and Performance of Electrically Conductive Adhesives for Microwave Applications4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo 2000, s.232-239
1999Cyrański R., Konarski P., Wymysłowski A., Sobolewski A., Magiećko H., Marks J., Pytkowski S.Konstrukcja i wyniki badań pomp jonowo-sorpcyjnych PJ-50 i PJ-400Prace Naukowe Politechniki Warszawskiej, Elektronika, z.123, 1999 (V Krajowa Konferencja Techniki Pró?ni), s.109-112
1999Felba J.Wiązka elektronowa w techniceSeminaria Naukowe Wroc?awskiego Towarzystwa Naukowego, 1(52) B, 1999, s.95-99
1999Wymysłowski A.FEM modeling of a piezoresistive silicon pressure sensor4th International Workshop ECMS'99, Liberec (Czech Rep.), 1999, p.31-34
1999Konarski P., Iwanejko I., Wymysłowski A.Trawienie jonowe mikrocząstek pyłów zanieczyszczających środowiskoPrace Naukowe Politechniki Warszawskiej, Elektronika, z.133, 1999 (V Krajowa Konferencja Techniki Pró?ni), s.93-96
1999Felba J., Sielanko W.Możliwości modyfikacji wiązką elektronową warstwy wierzchniej stopów aluminiumPrace Naukowe Politechniki Warszawskiej, Elektronika, z.123, 1999 (V Krajowa Konferencja Techniki Pró?ni), s.211-214
1999Felba J., Friedel K.P., Habeck M., Krull P., Nitsche-Pagel T., Pobol I.L., Wohlfahrt H.The process optimization of electron beam active brazing of cubic boron nitride to tungsten carbide cutting toolsPrace Naukowe Politechniki Warszawskiej, Elektronika, z.123, 1999 (V Krajowa Konferencja Techniki Pró?ni), p.207-210
1999Felba J., Friedel K.P., Krull P. Nesteruk I.G., Pobol I.L.Obtaining of CBN-steel and CBN-tungsten carbide joints using electron beam active brazingPrace Naukowe Politechniki Warszawskiej, Elektronika, z.133, 1999 (V Krajowa Konferencja Techniki Pró?ni), s.60-64
1999Felba J.Emittance of high-power-density electron beam.
1999Wymysłowski A., Friedel K.The Thermo-Mechanical Analysis of Silicon Piezoresistive Pressure SensorsTransaction on the Precision and Electronic Technology, vol.4, 1999 (4th International Seminar in Precision and Electronic Technology, Warszawa 1999)
1999Dziuban J., Friedel K., Chotomski A.The Thermo-Mechanical Modeling of Silicon Piezoresistive Pressure Sensors in the Single or Twin-Chips Configuration23rd Conference of the International Microelectronics and Packaging Society - Poland Chapter, Ko?obrzeg 1999, p.257-262
1999Felba J., Friedel K.P., Laska W., Mościcki A., Piotrowski A.Investigation of the electrically conductive adhesives formulation for high frequency applications23rd Conference of the International Microelectronics and Packaging Society - Poland Chapter, Ko?obrzeg 1999, p.119-124
1999Dziuban J., Friedel K.P.The Semi-Flip-Chip attachment for single or twin-chips silicon piezoresistive pressure sensors12th European Microelectronics & Packaging Conference, Harrogate (England), 1999, p.61-67
1999Dziuban J., Friedel K.The silicon piezoresistive pressure sensors in the twin-chips configuration4th International Workshop ECMS'99, Liberec (Czech Rep.), 1999, p.31-34
1999Pobol I.L., Nesteruk I.G., Wohlfahrt H., Krull P., Felba J., Friedel K.P.Elektronno-luchevaya paika kubicheckogo nitrida bora k osnove iz tverdogo splavaSvarka i Rodstvennye Tekhnologii, No.2, Minsk 1999, s.43-46
1999Felba J., Friedel K.P., Laska W., Mo?cicki A.Electrically conductive adhesives for high frequency applications22nd International Spring Seminar on Electronics Technology, Dresden 1999, p.11-15
1998Felba J., Grodziński A., Olszewska-Mateja B.Utwardzanie wgłębne wiązką elektronową stali oraz stali z napoiną Fe-Cr-CMat. I Kongresu Polskiego Towarzystwa Pró?niowego, Kraków 1998, s.226- 231.
1998Cyrański R., Konarski P., Wymysłowski A., Sobolewski A.Pompy jonowo-sorpcyjne o podwyższonej stabilności pompowania gazów szlachetnych i aktywnychElektronika, 1998, vol.39, nr.5, s.34-39
1998Wymysłowski A., Konarski P., Cyrański R.Numeryczna metoda optymalizacji pompy jonowo-sorpcyjnej o ze względu na szybkość pompowaniaElektronika, 1998, vol.39, nr 5, s.27-33
1998Wymysłowski A., Friedel K.Modelling of a complete silicon pressure sensor structure21st International Spring Seminar on Electronic Technology, Neusiedl am See - Austria 1998, p.206-209
1998Wymysłowski A., Friedel K.A decision support system in electron beam welding6eme Colloque International sur le Soudage at la Fusion par Faisceau d'Electrons et Laser, Toulon 1998, p.717-724
1998Wymysłowski A.Optimization of mechanical and electrical properties of the complete silicon pressure structureII Konferencja Dydaktyczno-Naukowa, Gliwice 1998,
1998Friedel K.An alternative flip chip attachment using non-deformed Au-stud bumps21st International Spring Seminar on Electronic Technology, Neusiedl am See - Austria 1998, p.27-31
1998Felba J., Friedel K., Sielanko W.Elektronowiązkowa modyfikacja warstwy wierzchniej stali z powłoką chromowąMat. I Kongresu Polskiego Towarzystwa Pró?niowego, Kraków 1998, s.222- 225.
1998Felba J., Friedel K.P.The improvement of the electron gun for EB welding in the whole beam power range6eme Colloque International sur le Soudage at la Fusion par Faisceau d'Electrons et Laser, Toulon 1998, p.603-609
1998Wójcicki S., Friedel K.Systematical error of the measurement of electron beam emittanceVacuum, 1998, vol.51, No. 2, p.113-118
1997Łoziński W., Friedel K.Wetting behaviour of some lead-free solder alloys in the case of protected copper surfaces21st Conference of the International Society for Hybrid Microelectronics- Poland Chapter, Ustro? 1996, p.201-204
1997Bukat K., Friedel K., Kisiel R., Morawska Z.Wpływ parametrów lutowania na zwilżalność połączeń wykonywanych lutami bezołowiowymiVI Konferencja Naukowa Technologia Elektronowa ELTE'97, Krynica 1997, s.129-132
1997Dąbek J., Friedel K.Spawanie podwójnie załamaną, wirującą wiązką elektronowąElektronika, 1997, vol.38, nr 3, s.27-29
1997Decker I., Felba J., Friedel K.P., Maul C., Overrath J., Wohlfahrt H.A temperature measuring system for process control of CBN-metal electron beam active brazing5th International Conference on Electron Beam Technologies, Varna 1997, p.165-170
1997Denbnovetsky S.V., Felba J., Melnik V.I., Melnik I.V.Model of beam formation in a glow discharge electron gun with cold cathodeApplied Surface Science 111 (1997), p.288-1997
1997Friedel K., Kisiel R., Łoziński W.A study of wetting performance of lead-free solders20th International Spring Seminar on Electronic Technology, Szklarska Por?ba, 1997, p.13-18
1997Felba J., Friedel K., Sielanko W., Wójcicki S., Wymysłowski A.Wpływ parametrów strefy aktywnej wiązki elektronowej na kształt i jakość spoinyElektronika, 1997, vol. 38, nr 3, s.7-11
1997Felba J., Friedel K., Sielanko W., Wójcicki S., Wymysłowski A.Badania wpływu strefy aktywnej wiązki elektronowej na jakość połączeń spawanych elektronowoVI Konferencja Naukowa Technologia Elektronowa ELTE'97, Krynica 1997, s.311-314.
1997Felba J., Friedel K.P., Wójcicki SThe optimization of triode electron gun with thermonic cathodeApplied Surface Science 111 (1997), p.126-134
1997Felba J., Melnik V.I., Sielanko W., Tugai B.Wybrane metody ograniczania wadliwości spoin wykonywanych wiązką elektronówVI Konferencja Naukowa Technologia Elektronowa ELTE'97, Krynica 1997, s.315-1997
1997Felba J., Słówko W.System for weld face observation in electron beam welding machine5th International Conference on Electron Beam Technologies, Varna 1997, p.171-175
1997Friedel K.Badanie wpływu strefy aktywnej wiązki elektronowej na jakość połączeń spawanych elektronowoElektronika, 1997, vol.38, nr 3, s.5-6
1997Pobol.I.L., Nesteruk I.G., Felba J., Friedel K.Badania zjawisk na granicach faz ceramika - metal w połączeniach wykonanych wiązka elektronowąVI Konferencja Naukowa Technologia Elektronowa ELTE'97, Krynica 1997, s.417-420.
1997Friedel K., Gaczol M., Wymysłowski A.Komputerowy system doradczy do spawania elektronowego w próżniVI Konferencja Naukowa Technologia Elektronowa ELTE'97, Krynica 1997, s.319-322
1997Pobol I.L., Felba J., Friedel K., Nesteruk I.G.Lutowanie regularnego azotku boru ze stalą narzędziową przy użyciu wiązki elektronowejElektronika, 1997, vol. 38, nr 5, s.43-1997
1997Friedel K., Sielanko W.Przegląd metod wytwarzania wiązek elektronowych dużej mocy, stosowanych w technologii spawania elektronowegoElektronika, 1997, vol.38, nr 3, s.39-45
1997Friedel K., Sielanko W.,Modyfikacja powierzchni i spawanie wysokoenergetyczna wiązką elektronowąVI Konferencja Naukowa Technologia Elektronowa ELTE'97, Krynica 1997, s.233-236
1997Friedel K., Wymysłowski A.System ekspertowy w technologii spawania elektronowegoElektronika 1997, nr 3, s.12-17
1997Friedel K., Wymysłowski A.Application of an expert system in electron beam welding5th International Conference on Electron Beam Technologies, Varna 1997, p.131-136
1997Kisiel R., Friedel K., Bukat KEkologiczne materiały i technologie w montażu aparatury elektronicznejVI Konferencja Naukowa Technologia Elektronowa ELTE'97, Krynica 1997, s.87-90
1997Denbnovetskii S.V., Melnik V.I., Tugai B.A. Sielanko V., Felba J.Sistema formirowania kvazi-dvoinogo elektronnogo puchkaElektronika i svyaz, nr 3, cz.II, 1997, s.14-16.
1997Friedel KThe guidelines for selecting electrically and thermally conductive adhesives for use in assembly of microsystems3rd International Seminar in Precision and Electronic Technology, Warszawa 1997, p.19-20
1997Felba J., Friedel K.P., Sielanko W., Wójcicki S.The method of weld defects prevention in electron beam welding5th International Conference on Electron Beam Technologies, Varna 1997, p176-181
1997Dulak T., Friedel K.The technology of mechanical Au-stud bumping21st Conference of the International Society for Hybrid Microelectronics- Poland Chapter, Ustro? 1997, p.109-112
1997Felba J.Specjalne metody kształtowania wiązek elektronowych, stosowanych w technologii spawania elektronowegoElektronika, 1997, vol. 38, nr 3, s.7-11
1997Felba J., Friedel K.Optymalizacja triodowej wyrzutni elektronowej dużej mocyElektronika, 1997, vol. 38, nr 3, s.18-21
1997Felba J., Friedel K.Application of Taguchi method for electron gun optimization5th International Conference on Electron Beam Technologies, Varna 1997, p.17-22
1997Denbnovetsky S.V., Felba J., Melnik I.V., Melnik V.I.The design of a glow discharge electron gun with cold cathode by means of experimentally verified model of beam formation5th International Conference on Electron Beam Technologies, Varna 1997, p.23-1997
1997Denbnovetsky S.V., Felba J., Melnik V.I., Melnik I.V.Model formowania wiązki elektronowej w wyrzutni plazmowej z metalową katodą zimnąVI Konferencja Naukowa Technologia Elektronowa ELTE'97, Krynica 1997, s.289-1997
1996Friedel K., Pobol I.Optymalizacja procesu powierzchniowego hartowania elektronowego staliHut.Wiad. Hut. 1996, vol. 63, nr 7, s.247-253
1996Felba J.Wytwarzanie i pomiary wiązki elektronowej o dużej gęstości mocyOficyna Wydawnicza Politechniki Wrocławskiej, Wrocław 1996, 131s.
1996Bukat K., Friedel K., Kisiel R., Morawska Z., Pieńkowska B.Influence of halide content on wetting properties of solder-flux systems20th Conference of the International Society for Hybrid Microelectronics. Poland Chapter, Jurata 1996, p.101-104
1996Friedel K., Felba J., Pobol I., Wymysłowski A.A systematic method for optimizing the electron beam hardening processVacuum, 1996, vol. 47, No.10, p.1317-1324
1996Friedel K., Wymysłowski A.High spatial resolution measurement method of metal work function9th Conference on Electron Microscopy of Solids, Zakopane 1996, p.113-116
1996Kisiel R., Friedel K.Design of experiments: joint action of lead-free solders with low-solid fluxes19th International Spring Seminar on Electronic Technology, God - Hungary, 1996, p.124-128
1996Kisiel R., Friedel K., Bukat K.New materials technological trends in PCB manufacture and assembly20th Conference of the International Society for Hybrid Microelectronics. Poland Chapter, Jurata 1996, p.31-37
1996Słówko W., Drzazga W., Felba J.Low voltage scanning electron microscope with a combined multi-electrode retarding lens and detectorVacuum, 1996, vol. 47, No.10, p.1159-1162
1996Wymysłowski A.An expert system in field of electron beam welding5th International Scientific Conference on Mechanical and Materials Engineering, Gliwice-Wisła 1996, p.265-268
1996Friedel K.The repeatability of mechanical Au-stud bumps formation20th Conference of the International Society for Hybrid Microelectronics. Poland Chapter, Jurata 1996, p.129-132
1995Felba J.Diagnostic methods of electron beam used for thermal processes18th International Spring Seminar on Electronic Technology, Temesvar -Czech Republic, 1995, p.219-223
1995Wójcicki S., Friedel K.Projektowanie wyrzutni elektronowych dużej mocy z wykorzystaniem reguł skalowania systemów elektrono-optycznychElektronika 1995, vol.36, nr 11, s.32-36
1995Friedel K., Wymysłowski A.Contactless electron beam surface potential measurements and testing of networks18th International Spring Seminar on Electronic Technology, Temesvar-Czech Republic, 1995, p.214-218
1995Friedel K., Sielanko W.Future aspects of electron beam welding and surface modificationKovine, Zlit. Technol. 1995, vol.29, nr 3/4, p.369-376
1995Friedel K. Friedel Z.Orthogonal design for optimization of packages thermal resistance2nd Int. Seminar in Precision and Electronic Technology, Warszawa 1995, p.111-118
1995Friedel K.Future needs and requirements for high-density printed circuit boards19th Conference of the International Society for Hybrid Microelectronics. Poland Chapter, Por?bka-Kozubnik, 1995, p.83-88
1994Felba J., Friedel K., Sielanko W., Wójcicki S., Wymysłowski AApplication of experimental design to emittance improvement of electron gun with indirectly heated cathode4th International Conference on Electron Beam Technologies, Varna 1994, p.63-68
1994Wymysłowski A., Bielawski M.A computer modeling of surface heat source for electron beam hardening4th International Conference on Electron Beam Technologies, Varna 1994, p.143-148
1994Friedel K., Grodziński A., Sielanko W., Wójcicki S.Spawanie elektronowe - Perspektywy rozwojuV Konferencja Naukowa ELTE.94, Szczyrk 1994, s.789-794
1994Friedel K., Felba J.Experimental study of high power electron gun4th International Conference on Electron Beam Technologies, Varna 1994, p.69-76
1994Friedel K., Felba J.Quantitative study of experimental emittance diagrams4th International Conference on Electron Beam Technologies, Varna 1994, p.55-62
1994Friedel K., Felba J.Analiza fazowa wiązki elektronowej dużej mocyV Konferencja Naukowa. ELTE.94, Szczyrk 1994, s.845-848
1994Friedel K., Felba J.Measurements of beam emittance in electron beam weldingWeld.Int. 1994, vol.8, No.3, p.176-180
1994Felba J., Olszewska-Mateja B.Zastosowanie wiązki elektronowej do zwiększenia trwałości narzędzi urabiającychV Konferencja Naukowa ELTE.94, Szczyrk 1994, s.842-843
1994Felba J., Friedel K., Sielanko W., Wójcicki S., Wymysłowski A.Zastosowanie statystycznej metody projektowania doświadczeń do optymalizacji wyrzutni elektronowej z katodą pośrednio żarzonąV Konferencja Naukowa ELTE.94, Szczyrk, s.838-841
1994Friedel K.Application of Taguchi methods to improvement of packages thermal performance18th Conference of the International Society for Hybrid Microelectronics. Poland Chapter, Warszawa, 1994, p.113-116