| 2017 | Gierczak M., Stojek K., Dziedzic A. | Temperature distribution on a quad-core microprocessor and quad-core microprocessor/heat sink structure. | Przegląd Elektrotechniczny. 2017, R. 93, nr 2, s. 210-213. |
| 2017 | A. Mościcki, A. Smolarek-Nowak, J. Felba, A. Kinart | Ink for Ink-Jet Printing of Electrically Conductive Structures on Flexible Substrates with Low Thermal Resistance | Journal of Electronic Materials, Published online 14 February 2017 |
| 2016 | Gierczak M., Markowski M. P., Żaluk Z., Dziedzic A., Jankowski-Mihułowicz P. | Ink-Jet printed conductive films - geometrical and electrical characterization. | ISSE 2016 : 39th International Spring Seminar on Electronics Technology [Dokument elektroniczny] : "Printed Electronics and Smart Textiles" : Extended Abstracts, May 18-22, 2016, Pilsen, Czech Republik / eds. Tomáš Blecha [i in.]. Pilsen : University of West Bohemia, 2016. s. 1-6. |
| 2016 | Myśliwiec M., Kisiel R., Fałat T. | Die attach by diffusion Sn-Ag-Sn soldering in high temperature electronics applications. | ISSE 2016 : 39th International Spring Seminar on Electronics Technology [Dokument elektroniczny] : "Printed Electronics and Technology [Dokument elektroniczny] : "Printed Electronics and Smart Textiles" : Extended Abstracts, May 18-22, 2016, Pilsen, Czech Republik / eds. Tomáš Blecha [i in.]. Pilsen : University of West Bohemia, 2016. s. 140-143. |
| 2016 | Nowak D., Dziedzic A., Żaluk Z., Roguszczak H., Węglarski M. | Mechanical properties of SDM interconnections on flexible and rigid substrates. | Soldering & Surface Mount Technology. 2016, vol. 28, nr 1, s. 27-32. |
| 2016 | Sikora A., Bednarz Ł., Fałat T., Wałecki M., Adamowska M. | Investigation of the impact of simulated solar radiation on the micro-and nanoscale morphology and mechanical properties of a sheet moulded composite surface. | Materials Science-Poland. 2016, vol. 34, nr 3, s. 641-649 |
| 2016 | Stojek K., Fałat T., Felba J. Matkowski K. P., Macherzyński W., Mościcki A. | Thermal joints based on sintered silver micro- and nano- sized particles. | ISSE 2016 : 39th International Spring Seminar on Electronics Technology [Dokument elektroniczny] : "Printed Electronics and Smart Textiles" : Extended Abstracts, May 18-22, 2016, Pilsen, Czech Republik / eds. Tomáš Blecha [i in.]. Pilsen : University of West Bohemia, 2016. s. 116-121. |
| 2016 | Wiejak W., Wymysłowski A. | Experimental approach to validation of an analytical and numerical thermal analysis of a travelling wave tube | 39th International Microelectronics and Packaging IMAPS 2015 Conference [Dokument elektroniczny] : 20-23 September 2015, Gdańsk, Poland / eds. Piotr Jasiński, Krzysztof Górecki, Robert Bogdanowicz. Bristol : IOP Publishing, 2016. art. 012010, s. 1-9. |
| 2016 | Wymysłowski A., Górecka-Drzazga A., Sareło K. | Analytical, numerical and experimental approach to analysis properties of a silicon membrane pressure sensor | 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 [Dokument elektroniczny] : Montpellier, France, April 18-20, 2016. [Piscataway, NJ] : IEEE, cop. 2016. s. 1-7. |
| 2015 | Dąbrowska E., Teodorczyk M., Lipińska L., Krzyżak K., Dąbrowski A., Sobczak G., Kozłowska A., Matkowski P. K., Młożniak A., Maląg A. | Zastosowanie tlenku grafenu i grafenu w technologii diod laserowych. | Przegląd Elektrotechniczny. 2015, R. 91, nr 9, s. 1-4. |
| 2015 | Fałat T., Matkowski P. K., Stojek K., Felba J., Płatek B., Mościcki A. | The efficiency of heat transfer through the interface of sintered silver nanoparticles. | Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems and ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels InterPACKICNMM2015 [Dokument elektroniczny] : San Francisco, California, USA, July 6-9, 2015. [B.m.] : ASME, cop. 2015. s. 1-5. |
| 2015 | Fałat T., Płatek B. | Growth of intermetallic compound between indium-based thermal interface material and copper substrate: molecular dynamics simulations. | Materials Science-Poland. 2015, vol. 33, nr 2, s. 445-450. |
| 2015 | Matkowski P. K., Fałat T., Mościcki A. | Reliability of interconnections made of sintered silver nano particles. | Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems and ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels InterPACKICNMM2015 [Dokument elektroniczny] : San Francisco, California, USA, July 6-9, 2015. [B.m.] : ASME, cop. 2015. s. 1-6. |
| 2015 | Nowak D., Dziedzic A., Żaluk Z., Roguszczak H., Weglarski M. | Investigation of mechanical properties of SDM interconnections on flexible and rigid substrates. | 39th International Conference of IMAPS Poland [Dokument elektroniczny] : 20-23 September 2015, Gdańsk, Poland / Gdansk University of Technology [i in.]. [B.m. : b.w., 2015]. s. 1-9. |
| 2015 | Stojek K., Płatek B., Fałat T., Felba J., Matkowski P. K., Mościcki A. | The method of measuring the efficiency of heat transfer through thermal interface materials in microelectronics packaging. | 38th International Spring Seminar on Electronics Technology, ISSE 2015 [Dokument elektroniczny] : "Novel Trends in Electronics Manufacturing" : extended abstracts, May 6-10, 2015, Eger, Hungary / eds. Gábor Harsányi [i in.]. Budapest : Budapest University of Technology and Econimocs, 2015. s. 1-6. |
| 2015 | Tesarski S., Wymysłowski A., Allaf K. N. | Analysis of an influence of a conversion level on simulation results of the crosslinked polymers. | Molecular modeling and multiscaling issues for electronic material applications. Vol. 2 / Artur Wymysłowski [i in.] eds. Cham [i in.] : Springer, cop. 2015. s. 175-194. |
| 2015 | Wiejak W., Wymysłowski A. | Experimental validation of an analytical and numerical approach to thermal analysis of a travelling wave tube. | 39th International Conference of IMAPS Poland [Dokument elektroniczny] : 20-23 September 2015, Gdańsk, Poland / Gdansk University of Technology [i in.]. [B.m. : b.w., 2015]. s. 1-9. |
| 2015 | Wiejak W., Wymysłowski A. | Analytical, numerical and experimental approach to thermal analysis and design of a travelling wave tube. | 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 [Dokument elektroniczny]: Budapest, Hungary, April 20-22, 2015. [Piscataway, NJ] : IEEE, cop. 2015. s. 1-8. |
| 2015 | Wymysłowski A. | Adhesion work analysis by molecular modelling and wetting angle measurement. | Microelectronics Reliability. 2015, vol. 55, nr 5, s. 713-715. |
| 2015 | Wymysłowski A., Iwamoto N., Yuen M., Fan H. | Adhesion work analysis by molecular modelling and wetting angle measurement | http://link.springer.com/book/10.1007%2F978-3-319-12862-7 |
| 2014 | Allaf K. N., Król D. J., Wymysłowski A., Zubel I., Rola K. | Adhesion work analysis by molecular modelling and wetting angle measurement | 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Gent, Belgium, April 7-8-9, 2014 : IEEE, cop. 2014. s. 1-5. |
| 2014 | Fałat T.,Płatek B., Matkowski P. K., Felba J., Zandén C., Ye L., Liu J. | Experimental results versus numerical simulations of In/Cu intermetallic compounds growth and wetting angle measurement | 16th Electronics Packaging Technology Conference, EPTC 2014 [Dokument elektroniczny] : 3-5 December 2014, Singapore.[Piscataway, NJ] : IEEE, cop. 2014. s. 797-800. |
| 2014 | Fałat T., Stojek K., Matkowski P. K., Płatek B., Felba J., Mościcki A. | Influence of sintering process parameters on mechanical strength of joints based on silver nano particles | 16th Electronics Packaging Technology Conference, EPTC 2014 [Dokument elektroniczny] : 3-5 December 2014, Singapore.[Piscataway, NJ] : IEEE, cop. 2014. s. 801-804. |
| 2014 | Fałat T,Matkowski P. K.,Żaluk Z., Felba J., Mościcki A. | Mechanical strength of joints based on Nano-Ag sintering phenomena | 37th International Spring Seminar on Electronics Technology, ISSE 2014 [Dokument elektroniczny] : ""Advances in Electronic System Integration"" : conference proceedings, May 7-11, 2014, Dresden, Germany / eds. Manuela Franz, Johann Nicolics, Heinz Wohlrabe. [Piscataway, NJ] : IEEE, cop. 2014. s. 365-368." |
| 2014 | Jankowski K., Wymysłowski A. | Acceleration of life prediction of solder joints using multi-failure criteria | 37th International Spring Seminar on Electronics Technology, ISSE 2014 [Dokument elektroniczny] : ""Advances in Electronic System Integration"" : extended abstracts, May 7-11, 2014, Dresden, Germany / [eds. Heinz Wohlrabe, Manuela Franz, Johann Nicolics.Templin] : Verlag Dr. Markus A. Detert, 2014. s. 1-5." |
| 2014 | Jankowski K., Wymysłowski A. | Creep and fatigue as main degradation phenomena in reliability of solder joints | 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014 [Dokument elektroniczny] : proceedings of the conference, Gent, Belgium, April 7-8-9, 2014.[Piscataway, NJ] : IEEE, cop. 2014. s. 1-5. |
| 2014 | Kłossowicz A. S.,Winiarski P. W., Zawierta M., Stęplewski W., Dziedzic A. | Analysis of long-term stability of capacitors embedded in printed circuit boards | 37th International Spring Seminar on Electronics Technology, ISSE 2014 [Dokument elektroniczny] : ""Advances in Electronic System Integration"" : extended abstracts, May 7-11, 2014, Dresden, Germany / [eds. Heinz Wohlrabe, Manuela Franz, Johann Nicolics.Templin] : Verlag Dr. Markus A. Detert, 2014. s. 1-6." |
| 2014 | Matkowski P, K., Fałat T., Mościcki A. | Comparative analysis of novel thermal interface containing nano additives | 16th Electronics Packaging Technology Conference, EPTC 2014 [Dokument elektroniczny] : 3-5 December 2014, Singapore.[Piscataway, NJ] : IEEE, cop. 2014. s. 345-348. |
| 2014 | Matkowski P, K., Fałat T., Mościcki A. | Reliability testing of electrically conductive joints made of sintered nano silver | 2014 Electronic System-Integration Technology Conference (ESTC) [Dokument elektroniczny] : September 16-18, 2014, Helsinki, Finland. Piscataway, NJ : IEEE, cop. 2014. s. 1-6. |
| 2014 | Matkowski P. K., Fałat T., Żaluk Z., Felba J., Mościcki A. | Structure of the thermal interface connection made of sintered nano silver | 37th International Spring Seminar on Electronics Technology, ISSE 2014 [Dokument elektroniczny] : Advances in Electronic System Integration : conference proceedings, May 7-11, 2014, Dresden, Germany / eds. Manuela Franz, Johann Nicolics, Heinz Wohlrabe.[Piscataway, NJ] : IEEE, cop. 2014. s. 243-246. |
| 2014 | Mościcki A., Fałat T., Kinart A., Smolarek A., Merten E. | New nano size filled TIM material with high thermally conductive properties | 16th Electronics Packaging Technology Conference, EPTC 2014 [Dokument elektroniczny] : 3-5 December 2014, Singapore.[Piscataway, NJ] : IEEE, cop. 2014. s. 449-452. |
| 2014 | Palczyńska A., Wymysłowski A., Bieniek T., Janczyk G., Pasquet D., Dinh T. V. | Crosstalk phenomena analysis using electromagnetic wave propagation by experimental an numerical simulation methods | 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014 [Dokument elektroniczny] : proceedings of the conference, Gent, Belgium, April 7-8-9, 2014.[Piscataway, NJ] : IEEE, cop. 2014. s. 1-10. |
| 2014 | Płatek B.,Fałat T., Matkowski P. K., Felba J., Mościcki A. | Heat transfer through the interface containing sintered NanoAg based thermal interface material | 2014 Electronic System-Integration Technology Conference (ESTC) [Dokument elektroniczny] : September 16-18, 2014, Helsinki, Finland. Piscataway, NJ : IEEE, cop. 2014. s. 1-4. |
| 2014 | Płatek B., Fałat T., Felba J. | Evaluation of the interfacial resistance between carbon nanotube and silicon by using molecular dynamics simulations | 37th International Spring Seminar on Electronics Technology, ISSE 2014 [Dokument elektroniczny] : ""Advances in Electronic System Integration"" : conference proceedings, May 7-11, 2014, Dresden, Germany / eds. Manuela Franz, Johann Nicolics, Heinz Wohlrabe. [Piscataway, NJ] : IEEE, cop. 2014. s. 70-74." |
| 2014 | Swierczyński R., Urbański K., Wymysłowski A. | Improving co-design of smart sensor front-ends | Mixed design of integrated circuits and systems, MIXDES 2014 [Dokument elektroniczny] : proceedings of the 21th international conference, Lublin, Poland, 19-21 June 2014 / [ed. by Andrzej Napieralski]. Łódź : Department of Microelectronics and Computer Science. Lodz University of Technology, cop. 2014. s. 236-240. |
| 2014 | Swierczyński R., Urbański K., Wymysłowski A. | Methodology for supporting electronic system prototyping through semiautomatic component selection | 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014 [Dokument elektroniczny] : proceedings of the conference, Gent, Belgium, April 7-8-9, 2014.[Piscataway, NJ] : IEEE, cop. 2014. s. 1-4. |
| 2014 | Urbański K., Fałat T., Matkowski P. K., Szczerba M., Felba J., Mościcki A. | Investigation of electrical properties of contacts made of materials based on sintered nano-Ag particles | 37th International Spring Seminar on Electronics Technology, ISSE 2014 [Dokument elektroniczny] : ""Advances in Electronic System Integration"" : conference proceedings, May 7-11, 2014, Dresden, Germany / eds. Manuela Franz, Johann Nicolics, Heinz Wohlrabe. [Piscataway, NJ] : IEEE, cop. 2014. s. 247-251." |
| 2013 | Zawierta M., Płatek B., Fałat T., Felba J. | Coarse Grained Molecular Dynamics Study of Heat Transfer in Thermal Interface Materials | 36th International Spring Seminar on Electronics Technology "Automotive Electronics", 8-12 May 2013, Alba Iulia, Romania : IEEE, cop. 2013. s. 259-262 |
| 2013 | Fałat T., Płatek B., Zawierta M., Felba J. | Numerical study on thermal conductivity of nanomaterials - coarse grained molecular dynamics approach | 13th International Conference on Nanotechnology, August 5-8, 2013, Beijing, China. [B.m.] : IEEE, cop. 2013. s. 1159-1163. |
| 2013 | Felba J., Fałat T., Mościcki A. | Nano sized silver for electronic packaging | 13th International Conference on Nanotechnology, August 5-8, 2013, Beijing, China. [B.m.] : IEEE, cop. 2013. s. 30-33. |
| 2013 | Płatek B., Fałat T., Felba J. | Study on thermal conductivity of boron nitride in hexagonal structure in atomistic scale by using non-equilibrium molecular dynamics technique | 13th International Conference on Nanotechnology, August 5-8, 2013, Beijing, China. [B.m.] : IEEE, cop. 2013. s. 30-33. |
| 2013 | Płatek B., Fałat T., Felba J. | Molecular dynamics calculations of the growth rate constant and active energy for In/Cu compound in indium based thermal interface material | Proceedings of 37th International Microelectronics and Packaging IMAPS-CPMT Poland Conference : 22-25 September 2013, Kraków, Poland. [Kraków : International Microelectronics and Packaging Society, IMAPS - Poland Chapter, 2013]. s. 1-5. |
| 2013 | Chicot D., Tilkin K., Jankowski K., Wymysłowski A. | Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique | Microelectronics Reliability. 2013, s. 1-6. |
| 2013 | Jankowski K., Wymysłowski A., Chicot D. | Combined loading and failure analysis of lead-free solder joints due to creep and fatigue phenomena | Proceedings of 37th International Microelectronics and Packaging IMAPS-CPMT Poland Conference : 22-25 September 2013, Kraków, Poland. [Kraków : International Microelectronics and Packaging Society, IMAPS - Poland Chapter, 2013]. s. 1-6. |
| 2013 | Jankowski K., Świerczyński R., Urbański K., Wymysłowski A., Chicot D., Dudek R. | Maintenance of solder joints on the strength of simultaneously acting creep and fatigue phenomena by using microindentation technique | 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 : proceedings of the conference, Wrocław, Poland, April 15-16-17, 2013. [Piscataway, NJ] : IEEE, cop. 2013. s. 1-4. |
| 2013 | Król D. J., Wymysłowski A., Zubel I., Rola K. | Application of molecular modelling for analysis of a surface energy and its comparison with the experimental results based on wetting angle measurement | 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 : proceedings of the conference, Wrocław, Poland, April 15-16-17, 2013. [Piscataway, NJ] : IEEE, cop. 2013. s. 1-5. |
| 2013 | Swierczyński R., Urbański K., Wymysłowski A., Jankowski K. | Low-power smart sensor for laminar and turbulent flow detection in avionics application | 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 : proceedings of the conference, Wrocław, Poland, April 15-16-17, 2013. [Piscataway, NJ] : IEEE, cop. 2013. s. 1-4. |
| 2012 | Wymysłowski A. | Challenges of thermo-mechanical numerical prototyping in the contemporary electronic packaging | Elektronika (Warszawa). 2012, R. 53, nr 2, s. 23-26 |
| 2012 | Wymysłowski A. | Editorial : 2011 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems | Microelectronics Reliability. 2012, vol. 52, nr 7, s. 1253-1254 |
| 2012 | Wymysłowski A., Dowhań Ł. | Warstwy cienkie w montażu elektronicznym - właściwości i niezawodność | |
| 2012 | Wymysłowski A., Dowhań Ł. | Application of nanoindentation technique for investigation of elasto-plastic properties of the selected thin film materials | Microelectronics Reliability. 2012, 9 s. |
| 2012 | Weltevreden E., Tesarski S., Wymysłowski A., Erinc M., Gielen A. W. J. | A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging | Microelectronics Reliability. 2012, vol. 52, nr 7, s. 1300-1305 |
| 2012 | Tesarski S., Wymysłowski A. | Glass transition analysis of cross-linked polymers: numerical and mesoscale approach | Molecular modeling and multiscaling issues for electronic material applications / Nancy Iwamoto, Matthew M. F. Yuen, Haibo Fan eds. New York [i in.] : Springer, cop. 2012. s. 213-230 |
| 2012 | Tesarski S., Wymysłowski A., Hölck O. | Influence of conversion level on simulation results of crosslinked polymers | 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 : proceedings of the conference, Cascais, Portugal, April 16-17-18, 2012. [Piscataway, NJ] : IEEE, cop. 2012. 7 s. |
| 2012 | Swierczyński R., Wymysłowski A. | Experimental and numerical analysis of heat dissipation in electronic devices for the efficient energy management | Microelectronic materials and technologies. Vol. 1. Koszalin : Wydawnictwo Uczelniane Politechniki Koszalińskiej, 2012. s. 261-268 |
| 2012 | Jankowski K., Wymysłowski A., Chicot D. | Experimental system for analysing the combined loading and failure modes of solder joints in electronic packaging | 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 : proceedings of the conference, Cascais, Portugal, April 16-17-18, 2012. [Piscataway, NJ] : IEEE, cop. 2012. 5 s. |
| 2012 | Matkowski P. K., Fałat T. | Zastosowanie tomografii komputerowej do oceny jakości mikrostruktur elektronicznych | Elektronika (Warszawa). 2012, R. 53, nr 2, s. 48-51 |
| 2012 | Dąbrowski A., Matkowski P. K., Golonka L. | Fatigue strength testing of LTCC and alumina ceramics bonds | Materials Science-Poland. 2012, vol. 30, nr 4, s. 329-334 |
| 2012 | Urbański K. | Wybrane projekty koła naukowego MikroCpp - zastosowania systemu Android w elektronice | Elektronika (Warszawa). 2012, R. 53, nr 2, s. 21-22 |
| 2012 | Allaf K. N.,Świerczyński R. | Thermal energy harvester for battery-less sensor system | 10th Student's Science Conference Man - Civilization - Future : Wałbrzych, 12-15 July 2012. Wrocław : Oficyna Wydawnicza Politechniki Wrocławskiej, 2012. s. 9-14 |
| 2012 | Kłossowicz A., Winiarski P., Płatek B., Stęplewski W., Borecki J., Dziedzic A. | Power dissipation from resistors embedded in printed circuit boards | Proceedings of 2012 International Students and Young Scientists Workshop "Photonics and Microsystems" : international optoelectronics workshop, Szklarska Poręba, Poland, 6-8 July, 2012 / [eds. Jaroslaw Domaradzki, Michal Mazur, Kosma Baniewicz]. Wrocław : Oficyna Wydawnicza Politechniki Wrocławskiej, 2012. s. 57-62 |
| 2012 | Płatek B., Fałat T., Felba J. | The Influence of the Manufacture Process on the Thermal Conductivity of Polymer Base Thermal Interface Materials Containing Carbon Nano Tubes | PLUS 10/2012, p.2268 |
| 2012 | Matkowski P., Brabandt I. | Modal analysis of board vibration during mechanical reliability tests of lead-free solder joints | 4th Electronics System Integration Technologies Conference, Amsterdam, 2012 |
| 2012 | Fałat T, Felba J., Płatek B., Mościcki A., Smolarek A., Stojek K. | Photonic sintering process of ink-jet printed conductive microstructures | 4th Electronics System Integration Technologies Conference, Amsterdam, 2012 |
| 2012 | Urbański K.J., Fałat T., Felba J., Mościcki A., Smolarek A., Bonfert D., Bock K. | Experimental method for low-temperature sintering of nano-Ag inks using electrical excitation | 12th Nanotechnology Conference IEEE NANO 2012, Birmingham |
| 2012 | Mościcki A., Fałat T., Smolarek A., Kinart A., Felba J., Borecki J. | Interconnection process by ink jet printing method | 12th Nanotechnology Conference IEEE NANO 2012, Birmingham |
| 2012 | Płatek B., Fałat T., Felba J. | The Manufacture Process Influence on Thermal Conductivity of Polymers Thermal Interface Materials with Carbon Nanotubes | 35th Int. Spring Seminar on Electronics Technology, ISSE 2012, Bad Aussee |
| 2012 | Fałat T., Płatek B., Felba J. | Sintering Process of Silver Nanoparticles in Ink-Jet Printed Conductive Microstructures - Molecular Dynamics Approach | 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, Lisbon |
| 2011 | Allaf K. N. | A battery-free wireless sensor platform powered with multiple energy sources | Człowiek - cywilizacja - przyszłość : IX Konferencja Naukowa Studentów, Będlewo, 7-9 października 2011. Wrocław : Oficyna Wydawnicza Politechniki Wrocławskiej, 2011. s. 7-12 |
| 2011 | Dowhań Ł., Wymysłowski A., Janus P., Ekwińska M., Wittler O. | Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods | Microelectronics Reliability. 2011, vol. 51, nr 6, s. 1046-1053 |
| 2011 | Dowhań Ł., Wymysłowski A., Kaliciński S. Janus P. | Numerical prototyping methods in microsystem accelerometers design | Microelectronics Reliability. 2011, vol. 51, nr 7, p. 1276-1282 |
| 2011 | Matkowski P. | Acceleration factors of combined reliability tests of lead-free SnAgCu BGA interconnections | 18th European Microelectronics & Packing Conference, EMPC-2011 Brighton, 2011 |
| 2011 | Matkowski P. | Reliability of SnAgCu solder joints during vibration in various temperature | 34th International Spring Seminar on Electronics Technology, ISSE 2011, Tatranská Lomnica |
| 2011 | Matkowski P., Dudek R., Kreyssig K. | Reliability testing of SnAgCu solder joints under combined loading | Micromaterials and Nanomaterials, 2011, iss. 13, p. 86-91 |
| 2011 | Smolarek A., Mościcki A., Kinart A., Felba J., Fałat T. | Dependency of silver nanoparticles protective layers on sintering temperature of printed conductive structures | 34th International Spring Seminar on Electronics Technology, ISSE 2011, Tatranská Lomnica |
| 2011 | Płatek B., Fałat T., Felba J. | An accurate method for thermal conductivity measurement of thermally conductive adhesives | 34th International Spring Seminar on Electronics Technology, ISSE 2011, Tatranská Lomnica |
| 2011 | Mościcki A., Smolarek A., Felba J. Fałat T. | Influence of different type protective layer on silver metallic nanoparticles for Ink-Jet printing technique | 18th European Microelectronics & Packing Conference, EMPC-2011 Brighton, 2011 |
| 2011 | Felba J. | Inkjet printed electrically conductive structures for microelectronics | 34th International Spring Seminar on Electronics Technology, ISSE 2011, Tatranská Lomnica |
| 2011 | Fałat T., Felba J., Płatek B., Piasecki T., Mościcki A., Smolarek A. | Low-temperature, photonic approach to sintering the ink-jet printed conductive microstructures containing nano sized silver particles | 18th European Microelectronics & Packing Conference, EMPC-2011 Brighton, 2011 |
| 2011 | Falat T., Felba J., Moscicki A., Borecki J. | Nano-silver Inkjet Printed Interconnections through the Microvias for Flexible Electronics | 11th Nanotechnology Conference IEEE NANO 2011, Portland USA, pp.473-477 |
| 2011 | Platek B., Urbański K., Falat T., Felba J. | The Method of Carbon Nanotube Dispersing for Composites Used in Electronic Packaging | 11th Nanotechnology Conference IEEE NANO 2011, Portland USA, pp. 102-105 |
| 2011 | Falat T., Felba J., Matkowski P., Platek B., Demont P., Marcq F., Monfraix P., Moscicki A., Półtorak K. | Electrical, Thermal and Mechanical Properties of Epoxy Composites with Hybrid Micro- and Nano- Sized Fillers for Electronic Packaging | 11th Nanotechnology Conference IEEE NANO 2011, Portland USA, pp.97-101 |
| 2011 | Dowhań Ł., Wymysłowski A., Janus P., Ekwińska M., Wittler O. | Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods | Microelectronics Reliability 2011, vol. 51, nr 6, s. 1046-1053 |
| 2011 | Falat T., Felba J., Moscicki A., Borecki J. | Nano-silver Inkjet Printed Interconnections through the Microvias for Flexible Electronics | 11th Nanotechnology Conference IEEE NANO 2011, Portland USA, pp.473-477 |
| 2011 | Platek B., Urbański K., Falat T., Felba J. | The Method of Carbon Nanotube Dispersing for Composites Used in Electronic Packaging | 11th Nanotechnology Conference IEEE NANO 2011, Portland USA, pp. 102-105 |
| 2011 | Falat T., Felba J., Matkowski P., Platek B., Demont P., Marcq F., Monfraix P., Moscicki A., Półtorak K. | Electrical, Thermal and Mechanical Properties of Epoxy Composites with Hybrid Micro- and Nano- Sized Fillers for Electronic Packaging | 11th Nanotechnology Conference IEEE NANO 2011, Portland USA, pp.97-101 |
| 2011 | Dowhań Ł., Wymysłowski A., Wittler O. | Investigation of thin films by nanoindentation with DOE and numerical methods | 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-systems, EuroSimE 2011, Linz |
| 2011 | Tesarski S., Wymysłowski A., Hölck O. | Assessment of thermo mechanical properties of crosslinked epoxy mesoscale approach - preliminary results | 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-systems, EuroSimE 2011, Linz |
| 2011 | Tesarski S., Wymysłowski A., Mavinkurve A., Gielen A.W. J. | A multi-scale approach to the thermo-mechanical behaviour of silica-filled epoxies for electronic packaging | 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-systems, EuroSimE 2011, Linz |
| 2011 | Fałat T., Płatek B., Felba J. | Non-equilibrium molecular dynamics simulation of heat transfer in carbon nanotubes - verification and model validation | 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-systems, EuroSimE 2011, Linz |
| 2011 | Płatek B., Fałat T., Felba J. | The influence of molecular dynamics simulation parameters on the accuracy of carbon nanotubes thermal conductivity calculations | 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-systems, EuroSimE 2011, Linz |
| 2011 | Felba J. | Thermally conductive adhesives in electronics | W: Advanced adhesives in electronics: materials, properties and applications / ed. by M. O. Alam and C. Bailey. Oxford, Woodhead Publishing, 2011. s. 15-52, |
| 2011 | Marcq F., P. Demont P., Monfraix P., Peigney A., Laurent Ch., Falat T., Courtade F., Jamin T. | Carbon nanotubes and silver flakes filled epoxy resin for new hybrid conductive adhesives | Microelectronics Reliability 51 (2011) p. 1230-1234 |
| 2011 | Małecki K., Urbański K., Wymysłowski A. | A novel experimental setup for accelerated reliability assesment of solder and adhesive joints | Elektronika, Nr 3, 2011, s. 106-108 |
| 2011 | Falat T., Felba J., Matkowski P., Platek B., Demont P., Marcq F., Monfraix P., Moscicki A., Półtorak K. | Electrical, Thermal and Mechanical Properties of Epoxy Composites with Hybrid Micro- and Nano- Sized Fillers for Electronic Packaging | 11th Nanotechnology Conference IEEE NANO 2011, Portland USA, pp.97-101 |
| 2011 | Platek B., Urbański K., Falat T., Felba J. | The Method of Carbon Nanotube Dispersing for Composites Used in Electronic Packaging | 11th Nanotechnology Conference IEEE NANO 2011, Portland USA, pp. 102-105 |
| 2011 | Falat T., Felba J., Moscicki A., Borecki J. | Nano-silver Inkjet Printed Interconnections through the Microvias for Flexible Electronics | 11th Nanotechnology Conference IEEE NANO 2011, Portland USA, pp.473-477 |
| 2011 | Fałat T., Felba J., Płatek B., Piasecki T., Mościcki A., Smolarek A. | Low-temperature, photonic approach to sintering the ink-jet printed conductive microstructures containing nano sized silver particles | 18th European Microelectronics & Packing Conference, EMPC-2011 Brighton, 2011 |
| 2011 | Felba J. | Inkjet printed electrically conductive structures for microelectronics | 34th International Spring Seminar on Electronics Technology, ISSE 2011, Tatranská Lomnica |
| 2011 | Mościcki A., Smolarek A., Felba J., Fałat T. | Influence of different type protective layer on silver metallic nanoparticles for Ink-Jet printing technique | 18th European Microelectronics & Packing Conference, EMPC-2011 Brighton, 2011 |
| 2011 | Płatek B., Fałat T., Felba J. | An accurate method for thermal conductivity measurement of thermally conductive adhesives | 34th International Spring Seminar on Electronics Technology, ISSE 2011, Tatranská Lomnica |
| 2011 | Smolarek A., Mościcki A., Kinart A., Felba J., Fałat T. | Dependency of silver nanoparticles protective layers on sintering temperature of printed conductive structures | 34th International Spring Seminar on Electronics Technology, ISSE 2011, Tatranská Lomnica |
| 2011 | Matkowski P., Dudek R., Kreyssig K. | Reliability testing of SnAgCu solder joints under combined loading | Micromaterials and Nanomaterials, 2011, iss. 13, p. 86-91 |
| 2011 | Matkowski P. | Reliability of SnAgCu solder joints during vibration in various temperature | 34th International Spring Seminar on Electronics Technology, ISSE 2011, Tatranská Lomnica |
| 2011 | Matkowski P. | Acceleration factors of combined reliability tests of lead-free SnAgCu BGA interconnections | 18th European Microelectronics & Packing Conference, EMPC-2011 Brighton, 2011 |
| 2011 | Dowhań Ł., Wymysłowski A., Kaliciński S. Janus P. | Numerical prototyping methods in microsystem accelerometers design | Microelectronics Reliability. 2011, vol. 51, nr 7, p. 1276-1282 |
| 2011 | Dowhań Ł., Wymysłowski A., Janus P., Ekwińska M., Wittler O. | Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods | Microelectronics Reliability. 2011, vol. 51, nr 6, s. 1046-1053. |
| 2011 | Małecki K. Urbański K., Wymysłowski A. | A novel experimental setup for accelerated reliability assesment of solder and adhesive joints | Elektronika, 2011, R. 52, nr 3, s. 106-108. |
| 2011 | Tesarski S., Wymysłowski A., Hölck O. | Assessment of thermo mechanical properties of crosslinked epoxy mesoscale approach - preliminary results | 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-systems, EuroSimE 2011 s.5 |
| 2011 | Weltevreden E., Muga E., Tesarski S., Wymysłowski A., Mavinkurve A., Gielen A. | A multi-scale approach to the thermo-mechanical behaviour of silica-filled epoxies for electronic packaging | 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-systems, EuroSimE 2011 s.4 |
| 2011 | Marcq F., Demont P., Monfraix P., Peigney A., Laurent Ch., Falat T., Courtade F., Jamin T. | Carbon nanotubes and silver ?akes ?lled epoxy resin for new hybrid conductive adhesives | Microelectronics Reliability 51 (2011) 1230-1234 |
| 2011 | Fałat T., Płatek B., Felba J. | Non-Equilibrium Molecular Dynamics Simulation of Heat Transfer in Carbon Nanotubes - Verification and Model Validation | 12th Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2011, Linz, Austria, 2011 |
| 2011 | Platek B., Falat T., Felba J. | The influence of molecular dynamics simulation parameters on the accuracy of carbon nanotubes thermal conductivity calculations | 12th Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2011, Linz, Austria, 2011 |
| 2010 | Tesarski S., Wymysłowski A., Hölck O., Małecki K. | Experimental validation of molecular modeling of crosslinked polymers applied in electronic packaging | 10th Electron Technology Conference ELTE 2010 and 34th International Microelectronics and Packaging IMAPS-CPMT Poland Conference s.3 |
| 2010 | Tesarski S., Wymysłowski A., Hölck O., Małecki K. | Numerical and experimental assessment of moulding compounds thermo mechanical properties | Micromaterials and Nanomaterials. 2010, iss. 12, s. 126-129 |
| 2010 | Urbański K., Płatek B., Fałat T., Felba J., Marcq F. | Novel method for CNTs dispersion in fluids | 10th Electron Technology Conference ELTE 2010 and 34th International Microelectronics and Packaging IMAPS-CPMT Poland Conference, Wrocław, 22-25 September 2010 |
| 2010 | Grabiec P., Janus P., Janczyk G., Szynka J., Urbański K., Wymysłowski A., Camp O. op den, Battistig G., Weelden T. van der, Casselgren J., Schravendeel R., Thewissen H. | Nanoelectronics for safe, fuel efficient and environment friendly automotive solutions - an ENIAC joint undertaking research project. W: Automotive meets electronics, AmE 2010 | Beiträge der GMM-Fachtagung, vom 15. - bis 16. April 2010, Dortmund. Berlin |
| 2010 | Tesarski S., Hölck O., Płatek B., Wymysłowski A. | Influence of meso-scale analysis parameters of cross-linked polymers on final simulation results | 33rd International Spring Seminar on Electronics Technology, ISSE 2010, Warsaw, Poland, s. 408-411 |
| 2010 | Wiejak W., Wymysłowski A. | Uproszczony analityczny model rozpraszania mocy w linii opóźniającej lampy fali bieżącej | Elektronika 2010, R. 51, nr 3, s. 114-119 |
| 2010 | Wymysłowski A., Dowhań Ł., Wittler O., Mrossko R., Dudek R. | Application of nanoindentation technique to extraction of thin films properties through experimental and numerical analysis | Materials Science - Poland. 2010 |
| 2010 | Misiuk A., Bak-Misiuk J., Jung W., Felba J., Wierzchowski W., Wieteska K., Prujszczyk M. | Revealing the defects in electron-irradiated Czochralski silicon | Radiation Measurements, No 45 (2010) s.624-627. |
| 2010 | Platek B., Falat T., Felba J., Borzdun A. | The Study of Carbon Nanotube's Length in Reference to Its Thermal Conductivity by Molecular Dynamics Approach | 11th Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, s.4 |
| 2010 | Tesarski S.J., Hölck O., Wymysłowski A. | Numerical Approach to Multiscale Evaluation and Analysis of Tg of Crosslinked Polymers | 11th Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, s.4 |
| 2010 | Dowhań Ł., Wymysłowski A., Wittler O., Mroßko R. | Application of Numerical Optimization Algorithms Used to Investigation of Thin Films in Nanoindentation Test | 11th Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, s.5 |
| 2010 | Misiuk A., Jung W., Prujszczyk M., Bak-Misiuk J., Felba J. | Ujawnienie historii radiacyjnej napromieniowanego elektronami krzemu otrzymanego metodą Czochralskiego poprzez po-radiacyjną obróbkę termiczną | Przegląd Elektrotechniczny. 2010, vol. 86, nr 7, s. 29-31 |
| 2010 | Falat T., Felba J., Moscicki A., Smolarek A., Bock K., Bonfert D. | Influence of nano silver filler content on properties of ink-jet printed structures for microelectronics | 3rd Electronics Systemintegration Technology Conference, Berlin, 2010 |
| 2010 | Matkowski P., Felba J. | Influence of solder joint constitution and aging process duration on reliability of lead-free solder joints under vibrations combined with thermal cycling | 3rd Electronics Systemintegration Technology Conference, Berlin, 2010 |
| 2010 | Platek B., Falat T., Felba J. | The impact of carbon nanotubes diameter on their thermal conductivity - non-equilibrium molecular dynamics approach | 3rd Electronics Systemintegration Technology Conference, Berlin, 2010 |
| 2010 | Dowhań Ł., Wymysłowski A., Janus P., Ekwińska M., Wittler O. | Application of Multi-criteria Optimization Algorithms to Numerical Material Extraction of Thin Layers Through Nanoindentaion Technique | 3rd Electronics Systemintegration Technology Conference, Berlin, 2010 |
| 2009 | Wiejak W., Wymysłowski A. | Thermal analysis of TWT delay line by combined theoretical and numerical approach | 33rd International Conference of IMAPS - CPMT IEEE Poland, Pszczyna 2009, s. 359-362 |
| 2009 | Wymysłowski A., Wittler O., Mrossko R., Dudek R., Auersperg J., Dowhań Ł. | Numerical approach to extraction of elasto-plastic material models and corresponding properties of thin layers trough nanoidentation technique | International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, Delft, The Netherlands |
| 2009 | Felba J., Nitsch K, Piasecki T., Tesarski S., Moscicki A., Kinart A., Bonfert D., Bock K. | Properties of Conductive Microstructures Containing Nano Sized Silver Particles | 11th Electronics Packaging Technology Conference, Singapore 2009, s.879-883 |
| 2009 | Falat T., Platek B., Felba J. | Molecular Dynamics Study of the Chiral Vector Influence on Thermal Conductivity of Carbon Nanotubes | 11th Electronics Packaging Technology Conference, Singapore 2009, s.636-639 |
| 2009 | Dowhań Ł., Wymysłowski A., Dudek R. | Multi-objective decision support system in numerical reliability optimization of modern electronic packaging | Microsystem Technologies: Micro- and Nanosystems - Information Storage and Processing Systems, 2009, vol. 15, nr 12, s. 1777-1783. |
| 2009 | Marenco N., Allegato G., Kostner H., Gal W., Conte A., Malecki K., Reinert W., Warnat S., Lange P., Gruenzig S., Hillmann S., Guadagnuolo S., Friedel K. | Investigation of Key Technologies for System-In-Package Integration of Inertial Mems | Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Rome, Italy |
| 2009 | Malecki K., Falat T., Tarczkowska E., Bock G., Hillmann G., Sigl A., Marenco N., Friedel K. | A Numerical Study on Optimization of Stresses Occurred During Chip to Wafer Bonding in Vacuum | IMAPS 5th International Conference and Exhibition on Device Packaging, Scottsdale/Fountain Hills, Arizona USA |
| 2009 | Gal W., Wensink, Malecki K., Friedel K. | Wafer level packaging by using transfer molding | Smart Systems Integration, European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components |
| 2009 | Fałat T., Friedel K., Marenco N., Warnat S. | TSV constraints related to temperature exursion, pressure during molding, materials used and handling loads. Microsystem Technologies | Micro- and Nanosystems - Information Storage and Processing Systems. 2009, vol. 15, nr 1, s. 181-190 |
| 2009 | Fałat T., Friedel K., Małecki K., Uruska D., Gal W. | The influence of process parameters and materials properties on stress distribution in MEMS - ASIC integrated systems after molding - numerical and experimental approach | International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, Delft, The Netherlands |
| 2009 | Fałat T., Jansen Kaspar M. B., Vreugd J., Rzepka S. | Influence of cure dependency of molding compound properties on warpage and stress distribution during and after the encapsulation of electronics components | International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, Delft, The Netherlands |
| 2009 | Fałat T., Vreugd J., Jansen Kaspar M. B., Ernst L., Bohm C. | Cure induced warpage of micro-electronics: comparison with experiments | International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, Delft, The Netherlands |
| 2009 | Dowhan L., Wymysłowski A., Urbanski K. | Simulated Annealing as a Global Optimization Algorithm Used in Numerical Prototyping of Electronic Packaging | International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, Delft, The Netherlands |
| 2009 | Platek B., Falat T., Felba J. | The impact of the number of walls on CNTs thermal conductivity - molecular dynamics approach | 33rd International Conference of IMAPS - CPMT IEEE Poland, Pszczyna 2009, s. 285-290 |
| 2009 | Matkowski P., Zawierta R., Urbański K., Felba J. | Stability of Solder Joint Resistance After Multiple Aging Processes. Repeatable Multiple Measurements of Solder Joint Resistance | 33rd International Conference of IMAPS - CPMT IEEE Poland, Pszczyna 2009, s. 255-260 |
| 2009 | Matkowski P., Małecki Ł., Bober B., Felba J. | Resistance changes of lead-free solder joints induced by defects of their structure | 33rd International Conference of IMAPS - CPMT IEEE Poland, Pszczyna 2009, s. 251-254 |
| 2009 | Matkowski P., Obajtek P., Bober B., Felba J. | Influence of soldering and aging processes on the structure of lead-free solder joints | 33rd International Conference of IMAPS - CPMT IEEE Poland, Pszczyna 2009, s. 247-250 |
| 2009 | Karolczyk J., Kozłowski M., Wymysłowski A. | Application of semantic network tools at prototyping stage of electronic packaging | 33rd International Conference of IMAPS - CPMT IEEE Poland, Pszczyna 2009, s. 171-174 |
| 2009 | Wymysłowski A. | Application of thermo-mechanical numerical prototyping in electronic | 33rd International Conference of IMAPS - CPMT IEEE Poland, Pszczyna 2009, s. 44-49 |
| 2009 | Felba J., Nitsch K., Piasecki T., Paluch P. Moscicki A., Kinart A. | The Influence of Thermal Process on Electrical Conductivity of Microstructures Made by Ink-Jet Printing with the Use of Ink Containing Nano Sized Silver Particles | 9th IEEE Conference on Nanotechnology, Genoa 2009, s. 494-497 |
| 2009 | Borecki J., Felba J., Wymysłowski A. | Analysis of blind microvias forming process in multilayer printed circuit boards | Materiały Elektroniczne, T.37, Nr 1. 2009, s.59-72 |
| 2009 | Falat T., Platek B., Tesarski S., Felba J. | An Approach to Measurement and Evaluation of the Thermal Conductivity of the Thermal Adhesives in Electronic Packaging | 32nd International Spring Seminar on Electronics Technology, Brno 2009 |
| 2009 | Matkowski P., Zawierta R., Felba J. | Vibration Response of Printed Circuit Board in Wide Range of Temperature. Characterization of PCB Materials | 32nd International Spring Seminar on Electronics Technology, Brno 2009 |
| 2009 | Wymysłowski A., Dowhań Ł., Felba J., Wittler O., Mrossko R., Dudek R., Michel B. | Combined numerical and experimental approach for extraction of elasto-plastic material properties in case of thin layers | Micromaterials and Nanomaterials, 2009, No. 9, s. 128-132 |
| 2009 | Dowhań Ł., Wymysłowski A., Felba J., Dudek R., Auersperg J., Michel B. | Application of multi-criteria optimization to stacked packaging | Micromaterials and Nanomaterials 2009 No 9, s. 120-125 |
| 2008 | Dowhań Ł., Wymysłowski A., Dudek R. | An approach of numerical multi-objective optimization in stacked packaging | Microelectronics Reliability. 2008, vol. 48, nr 6, s. 851-857 |
| 2008 | Malecki K., Pikur L., Falat T., Bock G., Hillmann G., Sigl A., Marenco N., Friedel K. | A Numerical Study on Heat Flow and Load Distribution during Chip to Wafer or Wafer to Wafer Bonding in Vacuum | EPTC 2008, 10th Electronics Packaging Technology Conference, Singapore, pp.18-23 |
| 2008 | Marenco N., Reinert W., Warnat S., Lange P., Gruenzig S., Hillmann G., Kostner H., Bock G., Guadagnuolo S., Conte A., Friedel K., Malecki K. | Vacuum Encapsulation of Resonant MEMS Sensors by Direct Chip-to-Wafer Stacking on ASIC | EPTC 2008, 10th Electronics Packaging Technology Conference, Singapore, pp.773-777 |
| 2008 | Marenco N., Reinert W., Warnat S., Lange P., Allegato G., Ungaretti T., Hillmann G., Bock G., Gal W., Guadagnuolo S., Conte A., Friedel K., Malecki K., Falat T. | Reliability and Test Challenges around C2W and W2W SiP assemblies | Symposium 2008 Reliability and DfX Engineering Workshop, Pallanza, Lago Maggiore, Italy |
| 2008 | Dowhań Ł., Wymysłowski A., Felba J., Dudek R. | The polymer materials as the essential input parameters in numerical multi-objective optimization of stacked packaging | The 7th IEEE Conference on Polymers & Adhesives in Microelectronics and Photonics, Polytronic 2008, Garmisch-Partenkirchen |
| 2008 | Tesarski S., Urbański K., Płatek B. | An Analysis of VOC-free fluxes and lead-free solders application in a manual SMD soldering | 2008 International Students and Young Scientists Workshop Photonics and Microsystems(http://ieeexplore.ieee.org) |
| 2008 | Płatek B., Tesarski S. | Susceptibility of solder masks on solderballing and webbing in wave soldering | 2008 International Students and Young Scientists Workshop Photonics and Microsystems(http://ieeexplore.ieee.org) |
| 2008 | Zawierta R., Urbański K., Matkowski P. | A fast recorder for changes of a resistance during joint failure in electronics | 2008 International Students and Young Scientists Workshop Photonics and Microsystems(http://ieeexplore.ieee.org) |
| 2008 | Matkowski P., Friedel K. | Management of Waste Electrical and Electronic Equipment in Poland - ecological, organizing and economical aspects | 2008 International Students and Young Scientists Workshop Photonics and Microsystems(http://ieeexplore.ieee.org) |
| 2008 | Matkowski P. | Treatment of waste electrical and electronic equipment. Technologies of disassembly, recycling stages | Progress in eco-electronics. Eds Krystyna Bukat, Józef Gromek, Marek Gonera. Warsaw : Tele & Radio Res. Inst., 2008. s. 143-147 |
| 2008 | Matkowski P., Friedel K., Felba J. | Organizacja systemu gospodarowania zużytym sprzętem elektrycznym i elektronicznym w Polsce | Polski Kongres Logistyczny LOGISTICS 2008. Nowe wyzwania - nowe rozwiązania., Poznań, 7-9 maja 2008. Poznań : Instytut Logistyki i Magazynowania, s. 109-123, 1 rys., 2 tab., bibliogr. 13 poz. |
| 2008 | Matkowski P., Wymysłowski A., Felba J. | Molecular modeling as a novel and promising numerical tool in microelectronics packaging | Electron Technology - Internet Journal 2005/2006 vol. 37/38, nr 14, s. 1-6, 8 (http://www.ite.waw.pl/etij/) |
| 2008 | Matkowski P., Friedel K., Felba J. | Treatment of Waste Electrical and Electronic Equipment. Technologies of Disassembling, Recycling Stages | Monographies of Tele & Radio Research, Warszawa 2008, p.143-147 |
| 2008 | Matkowski P., Friedel K., Felba J. | System of Waste Electrical and Electronic Equipment Management - Potential Directions of Development in a-few year perspective | Monographies of Tele & Radio Research, Warszawa 2008, p.178-184 |
| 2008 | Felba J. | Nanomaterials and Technologies for Conductive Miscrostructures | 31st International Spring Seminar on Electronics Technology, Budapest 2008, p.207-212 |
| 2008 | Małecki K., Bock G., Hllmann G., Friedel K. | Thermo-Mechanical Modelling of Chip to Wafer Hermetic Vacuum Bonding Process | Smart System Integration, 2nd European Conference & Exhibition, Barcelona 2008, p 489-491 |
| 2008 | Dowhań Ł., Wymysłowski A., Dudek R. | An approach of numerical multi-objective optimization in stacked packaging | Microelectronics and Reliability. 2008 vol. 48, nr 6, s. 851-857, 11 rys., 2 tab., bibliogr. 7 poz. |
| 2008 | Matkowski P., Urbański K., Fałat T., Felba J., Żaluk Z., Zwierta R., Dasgupta A., Pecht M. | Application of FPGA units in combined temperature cycle and vibration reliability tests of lead-free interconnections | 2nd Electronics Systemintegration Technology Conference, London-Greenwich, 2008, p.1375-1379 |
| 2008 | Zawierta R., Matkowski P., Urbanski K., Felba J. | Data Visualization in a Fast Data Acquisition System for Long-term Reliability Tests of Microelectronic Interconnections | 2nd Electronics Systemintegration Technology Conference, London-Greenwich, 2008, p.481-484 |
| 2008 | Dowhań Ł., Wymysłowski A., Felba J., Wiese S., Wolter K.J. | Application of genetic algorithm in numerical multi-objective optimization of ceramic capacitors | 2nd Electronics Systemintegration Technology Conference. [ESTC] 2008. Proceedings, Greenwich, UK, [1st-4th September] 2008. Vol. 1. Piscataway, NJ : IEEE, cop. 2008. s. 377-382, 14 rys., 1 tab., bibliogr. 6 poz. |
| 2008 | Wymysłowski A., Wittler O., Mrossko R., Dudek R. | Application of nanoindentation technique in microelectronics | 32nd International IMAPS-IEEE CPMT Poland Conference, Warszawa-Pułtusk, 21-24 September 2008. Warszawa : Oficyna Wydaw. PWarsz., [2008. 5] s., 14 rys., bibliogr. 5 poz. |
| 2008 | Borecki J., Felba J., Wymysłowski A. | Analysis of blind microvias forming process in multilayer printed circuit boards | 32nd International IMAPS-IEEE CPMT Poland Conference, Warszawa-Pułtusk, 21-24 September 2008. Warszawa : Oficyna Wydaw. PWarsz., [2008. 6] s., 8 rys., 10 tab., bibliogr. 2 poz. |
| 2008 | Wymysłowski A., Bober B., Dowhań Ł., Fałat T., Felba J., Małecki K., Matkowski P., Urbański K., Zawierta R., Żaluk Z. | Numerical and experimental approach to strength assessment of solder and adhesive joints by shearing test | 32nd International IMAPS-IEEE CPMT Poland Conference, Warszawa-Pułtusk, 21-24 September 2008. Warszawa : Oficyna Wydaw. PWarsz., [2008. 4] s., 7 rys., 2 tab., bibliogr. 5 poz. |
| 2008 | Falat T., Friedel K., Marenco N., Warnat S. | TSV constraints related to temperature excursion, pressure during molding, materials used and handling loads | Microsystem Technologies, 2009 vol.15, no 1, pp 181-190 |
| 2008 | Fałat T., Wymysłowski A., Kolbe J., Jansen K.M.B., Ernst L. | Influence of matrix viscoelastic properties on thermal conductivity of TCA-numerical approach | Microelectronics and Reliability, 2007 vol. 47, no 12, pp. 1989-1996 |
| 2008 | Tesarski S., Płatek B. | Topniki wodne w kontekście zielonej elektroniki | VI Konferencja Naukowa Studentów KNS 2008 materiały konferencyjne |
| 2007 | Borecki J., Wymysłowski A. | Numerical modeling of electrical resistance of interconnections in High-Tech multilayer PCBs manufactured by magnetron sputtering deposition of copper | Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. EuroSimE 2007, London, April 16-17-18, 2007 / Ed. by L. J. Ernst [i in.]. Piscataway, NJ : IEEE, cop. 2007. s. 487-492, 15 rys., 1 tab., bibliogr. 8 poz. |
| 2007 | Dowhań Ł., Wymysłowski A., Dudek R. | Multi-objective parametric approach to numerical optimization of stacked packages | Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. EuroSimE 2007, London, April 16-17-18, 2007 / Ed. by L. J. Ernst [i in.]. Piscataway, NJ : IEEE, cop. 2007. s. 637-643, 11 rys., 2 tab., bibliogr. 5 poz. |
| 2007 | Kisiel R., Felba J., Borecki J., Fałat T., Mościcki A. | Kompozycje elektrycznie przewodzące w produkcji płytek drukowanych | Elektronika Nr 6, 2007, p.31 |
| 2007 | Wymysłowski A., Bober B., Dowhań Ł., Fałat T., Felba J., Małecki K., Matkowski P., Urbański K., Żaluk Z. | Shearing test for solder joint reliability assessment | 31st International Conference of International Microelectronics and Packaging Society - Poland Chapter, Rzeszów-Krasiczyn 2007, p.275-278 |
| 2007 | Felba J., Fałat T., Wymysłowski A. | Influence of thermo-mechanical properties of polimer matrics on the thermal conductivity of adhesives for microelectronic packaging | Materials Science-Poland, Vol.25, No.1, 2007, p.45-55 |
| 2007 | Bober B., Bochenek A., Olszewska-Mateja B., Żaluk Z.Z. | Investigation of mechanical strength and electrical resistance of adhesives and adhesive joints in liquid nitrogen | Microelectronics International, Vol.25, No 1, 2007, p.49-53 |
| 2007 | Fałat T., Wymysłowski A., Kolbe J. | Numerical approach to characterization of thermally conductive adhesives | Microelectronics Reliability 47 (2007) p.342-346 |
| 2007 | Kisiel R., Felba J., Borecki J., Mościcki A. | Problems of PCB microvias filling by conductive paste | Microelectronics Reliability 47 (2007) p.335-341 |
| 2007 | Wymysłowski A., van Driel W.D., van de Peer J., Tzannetakis N., Zhang G.O. | Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability | Microelectronics Reliability 47 (2007) p.280-289 |
| 2007 | Mościcki A., Felba J., Gwiaździński P., Puchalski M. | Conductivity improvement of microstructures made by nano-size-silver filled formulations | 6th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Tokyo 2007, p.305-310 |
| 2007 | Falat T., Felba J. | Numerical Prediction of Influence Matrix and Filler Properties on Thermal Conductivity of Copper Filled TCA | 6th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Tokyo 2007, p.114-118 |
| 2007 | Felba J., Fałat T. | Thermally Conductive Adhesives for Microelectronics - Barriers of Heat Transport | 6th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Tokyo 2007, p.228-233 |
| 2006 | Friedel K., Matkowski P., Felba J. | Uproszczona ocena cyklu życia złączy wykonanych przy zastosowaniu bezołowiowych stopów lutowniczych oraz klejów elektrycznie przewodzących | Pr. Przem. Inst. Elektron. 2006 R. 47 nr 153 s.84-94 |
| 2006 | Matkowski P., Wymysłowski A., Felba J. | Application of molecular modeling as a novel and promising numerical tool in microelectronics | 30th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Kraków 2006, p.509-616 |
| 2006 | Kowalczyk M., Stonoga J., Matejko R., Urbański K., Fałat T., Paluszyński J., Licznerski B. | Universal controlling, data storage and visualization system | 30th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Kraków 2006, p.505-508 |
| 2006 | Kisiel R., Borecki J., Felba J., Mościcki A. | Climatic testing of PCB interconnections made by electrical conductive adhesives | 30th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Kraków 2006, p.335-338 |
| 2006 | Dowhań Ł., Wymysłowski A., Dudek R., Auersperg J. | Numerical Approach to Optimization of Stacked Packages | 30th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Kraków 2006, p.283-288 |
| 2006 | Fałat T. Felba J. | Conductivity improvement of electrically conductive adhesives by thermal post-curing process | 30th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Kraków 2006, p.301-306 |
| 2006 | Dowhań Ł., Wymysłowski A., Dudek R., Auersperg J. | Paramertric Approach to Numerical Design for Optimization of Stacked Packages | 1st Electronics Systemintegration Technology Conference, Dresden 2006, p.1194-1202 |
| 2006 | Fałat T., Felba J., Wymysłowski A., Jansen K.M.B. Nakka J.S. | Viscoelestic characterization of Polymer Matrix of Thermal Conductive Adhesives | 1st Electronics Systemintegration Technology Conference, Dresden 2006, p.773-781 |
| 2006 | Borecki J., Felba J., Gromek J. Posadowski W.M. | Interconnections in Multilayer PCBs based on Microvias Metallized by Magnetron Sputtering Deposition | 1st Electronics Systemintegration Technology Conference, Dresden 2006, p.525-531 |
| 2006 | Mościcki A., Felba J. Dudziński W. | Conductive Microstructures and Connections for Microelectronics Made by Ink-Jet Technology | 1st Electronics Systemintegration Technology Conference, Dresden 2006, p.511-517 |
| 2006 | Borecki J., Felba J., Posadowski W. | Quality of PCB interconnections based on blind microvias metallized by magnetron sputtering deposition | 29th International Spring Seminar on Electronics Technology ISSE 2006. Proceedings, St. Marienthal 2006 |
| 2006 | Jung W., Misiuk A., Felba J., Megela L.G., Azhiniuk Yu., Prujszczyk M. | Electrical Properties of Electron - Irradiated Cz-Si after Processing under Enhanced Hydroststic Pressure | 8th Int. Conf. on Electron Beam Technologies, Varna 2006, Electrotechnica & Electronica 5-6/2006, p.161-169 |
| 2006 | Fałat T, Felba J. | Electron Beam as a Heat Source in Thermal Diffusivity Measurement of Thermally Conductive Adhesives | 8th Int. Conf. on Electron Beam Technologies, Varna 2006, Electrotechnica & Electronica 5-6/2006, p.189-193 |
| 2006 | Wiatrowski A., Posadowski W.M., Kulakowska-Pawlak B., Brudnik A., Felba J. | Optical Emission Spectroscopy Studies of DC and Medium Frequency Magnetron Sputtering Discharges | 8th Int. Conf. on Electron Beam Technologies, Varna 2006, Electrotechnica & Electronica 5-6/2006, p.161-169 |
| 2006 | Kisiel R., Felba J., Borecki J., Mo?cicki A. | Stability Properties of PCB Microvias Fillings made by Conductive Adhesives | 4th European Microelectronics and Packaging Symposium EMPS 2006 |
| 2005 | Wymysłowski A., Urbański K., Berlicki T. | Numerical simulation and optimisation of the vacuum microsensor | 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. EuroSimE, Berlin 2005, p.576-583 |
| 2005 | Matkowski P., Sakowicz M., Wymysłowski A., Felba J., Ambroziak A. | Accelerated Tin Whisker Growth. Identification of Significant Factors for Design of Experiment | 29th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Koszalin-Darłówko 2005, p.103-106 |
| 2005 | Kisiel R., Felba J. | Ekologiczna elektronika - uwarunkowania materiaowe i technologiczne | Elektronika rok XLVI nr 12/2005 str. 75-77 |
| 2005 | Kisiel R., Borecki J., Koziol G., Felba J. | Conductive adhesives for through holes and blind vias metallization | Microelectronics Reliability 45 (2005) p.1935-1940 |
| 2005 | Borecki J. Felba J., Posadowski W. | Magnetron Sputtering Deposition of Copper on Polymers in High Density Interconnection PCBs | 5th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Wroclaw 2005, p.192-196 |
| 2005 | Falat T., Wymysłowski A., Kolbe J. | Numerical Approach to Characterization of Thermally Conductive Adhesives | 5th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Wroclaw 2005, 180- 184 |
| 2005 | Qi H., Ganesan S., Wu Ji, Pecht M. Matkowski P., Felba J. | Effects of Printed Circuit Board Materials on Lead-free Interconnect Durability | 5th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Wroclaw 2005, p.140-144 |
| 2005 | Kisiel R., Felba J., Borecki J., Moscicki M., | Problems of PCB Microvias Filling by Conductive Paste | 5th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Wroclaw 2005, p.96-101 |
| 2005 | Mościcki A., Felba J., Sobierajski T., Kudzia J., Arp A., Meyer W. | Electrically Conductive Formulations Filled Nano Size Silver Filler for Ink-Jet Technology | 5th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Wroclaw 2005, p.40-44 |
| 2005 | Lachowicz M., Dudzinski W., Felba J., Haimann K. | Analiza mikrostruktury warstw przetopionych wiazk elektronow w stopie inconel 713C | Inz. Mater. 26 nr 5, 2005, s.314-316 |
| 2005 | Fałat T., Felba J., Matkowski P., Urbański K., Zaluk Z. | Combined System for Testing of Joints in Microelectronic Packaging Under Thermal Cycling, Humidity and Vibration Loading | 29th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Koszalin-Darłówko 2005, p.235-238 |
| 2005 | Matkowski P., Haiyu Q. | Vibration test utilization in the study of reliability of connections in microelectronics | 2005 International Students and Young Scientists Workshop Photonics and Microelectronics |
| 2005 | Kisiel R., Mo?cicki A., Felba J., Borecki J. | Technological Aspects of Applying Adhesives in Small Diameter Vias | 29th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Koszalin-Darłówko 2005, p.99-102 |
| 2005 | Mościcki A., Felba J., Sobierajski T., Kudzia J. | Snap Curing Electrically Conductive Adhesive Formulation for Solder Replacement Applications | Journal of Electronic Packaging, Vol.127, No 2, 2005, p.91-95 |
| 2005 | Urbański K., Fałat T., Felba J., Ganesan S., Pecht M. | A novel test data-acquisition system for vibration testing of printed circuit board assemblies | 15th European Microelectronics and Packaging Conference & Exhibition, Brugge 2005, p.178-183 |
| 2005 | Ganesan S., Kim G., Wu J., Pecht M., Lee R., Lo J., Fu Y., Li Y., Xu M., Felba J. | Solder Joint Defects of PBGs after Lead-free Assembly | 15th European Microelectronics and Packaging Conference & Exhibition, Brugge 2005, p.63-68 |
| 2005 | Wymysłowski A., Santo-Zarnik M., Belavic D | Sequential approach to numerical optimization of the LTCC ceramic pressure sensor | 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. EuroSimE, Berlin 2005, p.376-383 |
| 2005 | Kisiel R., Borecki J., Felba J., Mościcki A. | Electrically Conductive Adhesives as Vias Fill in PCBs: the influence of fill shape and contact metallization on vias resistance stability | 28th International Spring Seminar on Electronics Technology, Wiener Neustadt 2005, p.193-198 |
| 2005 | Wymysłowski A., van Driel W., Zhang G., van de Peer J., Tzannetakis N. | Smart and sequential approach to numerical prototyping in micro-electronic applications | J. Microelectron. Electron. Packag. 2005, vol. 2 nr 1 p.1-7 |
| 2005 | Dora J.,Felba J., Sielanko W. | A new generation of power supplies for electron beam welding machines | Vacuum 77 (2005) 463-467 |
| 2005 | Wymysłowski A., Santo-Zarnik M., Belavic D | Tolerance Design of the LTCC Ceramic Pressure Sensor Sensivity | 29th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Koszalin-Darłówko 2005 |
| 2005 | Ganesan S., Kim G. Wu Ji, Pecht M., Felba J. | Lead-free Assembly Defects in Plastic Ball Grid Array Packages | 5th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Wroclaw 2005, p.219-223 |
| 2005 | Bochenek A., Bober B., Olszewska-Mateja B., Żaluk Z. | Mechanical strength and electrical resistance tests of adhesive joints particularly useful in low temperatures | XXIX International Conference of International Microelectronics and Packaging Society Poland Chapter. Proceedings. Koszalin-Darwko, 18-21 September 2005. p.87-90, |
| 2004 | Santo-Zarnik M. Belavic D., Wymysłowski A., Friedel K. | A numerical analysis of the piezoresistive properties of thick-film resistors in pressure-sensor applications | 3rd European Microelectronics and Packaging Symposium, Prague 2004, p.601-606 |
| 2004 | Olszewska K., Friedel K. | Control of the electron beam active zone position in electron beam welding processes | Vacuum 2004 vol. 74 nr 1 p.29-43 |
| 2004 | Friedel K. | Krytyczny przegląd bezołowiowych stopów lutowniczych | III Krajowa Konferencja Naukowo ? Techniczna Ekologia w Elektronice, Warszawa 2004, p.40-48 |
| 2004 | Wymysłowski A., Santo-Zarnik M., Friedel K., Belavic D. | Numerical Simulation and Experimental Verification of the Piezoresistivity Phenomenon for the Printed Thick-Film Piezoresistors | 5th International Conference on Thermal and Mechanical Simulation and Experipments in Microelectronics and Microsystems, Brussels 2004, p.359-366 |
| 2004 | Ambroziak A., Felba J., Kisiel R. | Luty bezołowiowe dla elektroniki | Przegl?d spawalnictwa nr 8-9/2004, p.101-104 |
| 2004 | Wymysłowski A., van Driel W.D., Zgang G.Q., van der Peer J., Tzannatakis N. | Smart and Sequential Approavch to Numerical Prototyping in micro-Electronic Applications | 28th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Wrocław 2004, p.421-425 |
| 2004 | Fałat T., Felba J., Wymysłowski A. | Improved Method for Thermal Conductivity Measurement of Polymer Based Materials for Electronic Packaging | 28th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Wrocław 2004, p.219-222 |
| 2004 | Borecki J., Kozioł G., Felba J., Kisiel R. | Conductive Adhesives for Trough Holes and Blind Vias Metallization | 28th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Wrocław 2004, p.175-178 |
| 2004 | Wójcicki S., Sielanko W., Czopik A., Pilarczyk J., Banasik M., Felba J., Dora J | Electron Beam Welding in Poland | Current Status and Development Perspectives |
| 2004 | Santo-Zarnik M., Belavic D., Friedel K., Wymysowski A. | A procedure for validating the finite element model of a piezoresistive ceramic pressure sensor | IEEE Trans. Compon. Packag. Technol. 2004, vol. 27 nr 4 p.668-675 |
| 2004 | van Driel W.D., van de Peer J., Tzannetakis N., Wymysłowski A., Zhang G.Q | Advanced Numerical Prototyping Methods in Modern Engineering Applications | 5th International Conference on Thermal and Mechanical Simulation and Experipments in Microelectronics and Microsystems, Brussels 2004, p.211-218 |
| 2004 | Kisiel R., Felba J. | Ecological Electronic Equipment Assembly - Materials and Technological Aspects | VII Electron Technology Conference, Stare Jabłonki 2004, p.53-54 |
| 2004 | Friedel K. | Design for reuse and recycling of electronic circuits | Global Symposium on Recycling, Waste Treatment and Clean Technology. REWAS '04. Ed. by I. Gaballah, Madrid, 2004. Vol. 3. p.2843-2844 |
| 2004 | Fałat T., Felba J. | Kleje elektrycznie przewodzące jako alternatywa dla lutów cynowo-ołowiowych | III Krajowa Konferencja Naukowo-Techniczna Ekologia w Elektronice, Warszawa 2004, p.58-66 |
| 2004 | Kisiel R., Borecki J., Felba J., Mościcki A. | Technological Aspects of Applaying Conductive Adhesives for Inner Connections in PCB | 4th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Portland 2004, AP32 |
| 2004 | Borecki J., Felba J., Posadowski W.M., Wojtalik K. | Magnetron Sputtering Technology for Microvias Metallization | 28th International Conference of International Microelectronics and Packaging Society - Poland Chapter, Wrocław 2004, p.171-174 |
| 2004 | Bochenek A.j, Bober B., Olszewska-Mateja B., Żaluk Z. | Wpływ domieszek Cu w drucie złotym oraz metalizacji aluminiowej na stabilność połączeń w ukadach elektronicznych i systemach sensorowych. W: Czujniki optoelektroniczne i elektroniczne. | COE 2004. VIII Konferencja naukowa. Materiay konferencyjne. Wrocaw, 27-30 czerwca 2004. p.77-81 |
| 2004 | Bochenek A., Bober B., Hauffe W., Łukaszewicz M., Langer E., | Thermal degradation of joined thick Au and Al elements. | Microelectronics International. 2004 vol. 21 nr 1 p.31-34 |
| 2004 | Felba J., Mościcki A., Bereski M. | Anisotropic Effect when Using Isotropic Conductive Adhesives | 4th International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Portland 2004, MP22 |
| 2004 | Friedel K. | Technologia lutowania spoiwami bezołowiowymi | III Krajowa Konferencja Naukowo-Techniczna Ekologia w Elektronice, Warszawa 2004, p.49-57 |
| 2004 | Friedel K. | Krytyczny przegląd bezołowiowych stopów lutowniczych | III Krajowa Konferencja Naukowo-Techniczna Ekologia w Elektronice, Warszawa 2004, p.40-48 |
| 2004 | Wymysłowski A.,Fałat T.,Friedel K.,Felba J. | Numerical simulation and experimental verification of the thermal contact properties of the polymers bonds | 5th International Conference on Thermal and Mechanical Simulation and Experipments in Microelectronics and Microsystems, Brussels 2004, p.177-183 |
| 2003 | Wymysłowski A., Friedel K., Felba J., Fałat T. | An experimental-numerical approach to thermal contact resistance | 9th International Workshop on Thermal Investigations of ICs and Systems, Aix-en-Provence, 2003, p.161-172 |
| 2003 | Santo-Zarnik M., Friedel K., Wymysłowski A., Belavic D. | Experimental verification of the finite-element model of a thick-film ceramic pressure sensor | 4th International Conference on Thermal & Mechanical Simulation and Experiments in Microelectronics and Microsystems. ESIME 2003 Aix-en-Provence, p.305-311 |
| 2003 | Fałat T., Felba J., Friedel K., Wymysłowski A. | Simulation based approach to thermal contact properties assessment in modern electronic packages | 10th Int. Conf. Mixed Design of Integrated Circuits and Systems, ŁódĄ 2003, p.361-366 |
| 2003 | Felba J. | Application of Polymers for Microelectronic Packaging | Proceedings of the m2ns2003 Workshop on Migration from Micro to Nano Sensors & Systems, Krefeld 2003, p.9-13 |
| 2003 | Bock K., Aschenbrenner R., Felba J. | Polymer Electronics - fancy or the future of electronics | 27th International Conference and Exhibition of the International Microelectronics and Packaging Society - Poland, Podlesice 2003, p.57-62 |
| 2003 | Bochenek A., Bober B., Olszewska-Mateja B., Żaluk Z. | Evaluation of silver alloys for thermosonic assembly of microelectronics circuits | 27th International Conference and Exhibition IMAPS - Poland 2003. Proceedings. Podlesice-Gliwice, 16-19 September 2003. p.118-121 |
| 2003 | Belavic D., Degen A., Dziedzic A., Friedel P.K., Golonka L., Hrovat M., Kita J., Santo-Zarnik M., Wymysłowski A. | Investigations of Materials and modeling of sensitivity of thick-film resistors on different substrates for strain-gauge applications | 14th European Microelectronics and Packaging Conf. & Exhibition, Friedrichshafen 2003, p.448-452 |
| 2003 | Mościcki A., Felba J., Sobierajski T., Kudzia J. | Snap curing electrically conductive formulation for solder replacement applications | 3rd International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Montreux, 2003, p.157-162 |
| 2003 | Friedel K., Wymysłowski A. | An approach to numerical simulation of thermal contact problems in modern electronic packages | 4th International Conference on Thermal & Mechanical Simulation and Experiments in Microelectronics and Microsystems. ESIME 2003 Aix-en-Provence, p.183-189 |
| 2002 | Wymysłowski A. | Reliability Prediction of the Solid Joints in Electronic Packages | European Microelectronics Packaging and Interconnections Symposium, Cracow 2002, p.375-381 |
| 2002 | Felba J. | Electrical Properties of Adhesive Joints | European Microelectronics Packaging and Interconnections Symposium, Cracow 2002, p.6-11 |
| 2002 | Felba J., Friedel K., Guenthner B., Mościcki A., Schäfer H., | The Influence of Filler Particle Shapes on Adhesive Joints in Microwave Applications | 2nd International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Zalaegerszeg, 2002, p.1-6 |
| 2002 | Friedel K. | Zaawansowane technologie w montażu aparatury elektronicznej | Elektronika 2002, vol.43 nr 7/8, p.25-27 |
| 2002 | Sielanko W., Czopik A., Felba J., Jędrzejczyk M. | Specjalistyczna spawarka elektronowa do wykonywania obwodowych spoin tłumików drgań skrętnych | Elektronika Nr 12, vol.XLIII, 2002. p.36-39 |
| 2002 | Miedziński B., Friedel K., Grodziński A., Wiśniewski G. | Performance of pure nickel as a contact material under inductive load DC | 50th Relay Conference NARM 2002, Newport Beach, California, p.2-5 |
| 2002 | Belavic D., Friedel K.P., Wymysłowski A., Santo-Zarnik M | Virtual Thermo-Mechanical Prototyping of the Ceramic Pressure Sensor | European Microelectronics Packaging and Interconnections Symposium, Cracow 2002, p.369-374 |
| 2002 | Bochenek A., Bober B. | Evaluation of soldering properties of silver conductor pads on LTCC structures using selected lead-free solders | European Microelectronics Packaging & Interconnection Symposium. IMAPS - Europe Cracow 2002. Proceedings. Cracow, 16-18 June 2002 . p.125-129 |
| 2002 | Bochenek A., Bober B., Olszewska-Mateja B., Żaluk Z. | Investigations of the influence of Au-alloy additives on diminishing Au-Al joints degradation. European Microelectronics Packaging & Interconnection Symposium | IMAPS - Europe Cracow 2002. Proceedings. Cracow, 16-18 June 2002. p.390-394 |
| 2002 | Belavic D., Friedel K.P., Wymysłowski A., Santo-Zarnik M | Virtual Prototyping of the Ceramic Pressure Sensor | Proceedings of the 3nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)- Electronics, Paris, 2002, pp.38-44 |
| 2001 | Friedel K. Kisiel R. | Finite-element modeling: strain & stress distribution in adhesive bonded joints of 1206 chip components on FR-4 substrates | 13th European Microelectronics and Packaging Conference, Strasburg 2001, p.382 -387 |
| 2001 | Dziduszko J., Wymysłowski A., Friedel K. | Numerical Method of Reliability Assessment of the Flip Chip Packaging | Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics, 2nd International Conference, Paris, 9-11 April 2001, p.263-267 |
| 2001 | Belavic D., Friedel K., Santo-Zarnik M., Hrovat M. | A design and simulate approach to improving the characteristics of ceramic pressure sensors | MIDEM Conference, Bohinj - Slovenia, 2001, pp.267-272 |
| 2001 | Felba J., Friedel K. | Electrical Conduction of Adhesive Joints in Microwave Applications | 1st International IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Potsdam 2001, p.71-78 |
| 2001 | Felba J., Friedel K. | Zastosowanie klejów w montażu aparatury elektronicznej | Elektronika Nr 10, vol.XLII, 2001, p.55-58 |
| 2001 | Felba J., Friedel K.P., Krull P., Pobol I.L., Wohlfahrt H. | Electron beam active brazing of cubic boron nitride to tungsten carbide cutting tools | Vacuum No 62, 2001, p.171-180 |
| 2001 | Wymysłowski A. | Probabilistic Approach to Numerical Reliability Assessment of Microelectronic Components | Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics, 2nd International Conference, Paris, 9-11 April 2001, p.67-73 |
| 2001 | Bochenek A., Bober B., Dziedzic A., Golonka L. | Investigations of assembly properties of conductive layers in LTCC circuits | Microelectronics International. 2001 vol. 18 nr 2 p.11-15 |
| 2001 | Felba J., Friedel K., Kisiel R., Mościcki R. | The Influence of Solver Filler Concentration in Epoxy Adhesives on Electrical and Mechanical Properties of Adhesive Joints | 25th International Conference and Exhibition of the International Microelectronics and Packaging Society - Poland, Rzeszów - Pola?czyk 2001, p.67-70 |
| 2000 | Krull P., Decker I., Maul Ch., Overrath J., Nitschke-Pagel T., Wohlfahrt H., Felba J., Friedel K.P. | Ein kontatloses Temperaturmesssystem zur Steuerung der Wärweeinbringung bei Elekronnenstrahlprozessen im Vakuum | Schweissen & Schneiden, 52, No.3, 2000, s.159-164 |
| 2000 | Wymysłowski A. | Numerical simulation and assesment of different piezoresistive silicon pressure sensor configurations | Mixed design of integrated circuits and systems. MIXDES 2000 |
| 2000 | Felba J., Friedel K., Kisiel R. | The Future Alternatives of Tin-Lead PCB Assembly | 24rd Conference of the International Microelectronics and Packaging Society - Poland Chapter, Rytro 2000, p.27-40 |
| 2000 | Felba J., Friedel K.P., Kisiel R., Laska W., Mościcki A. | Solder replacement with electrically conductive adhesives in microwave applications | European Microelectronics Packaging and Interconnection Symposium, Prague 2000, s.416-421 |
| 2000 | Wymysłowski A. | Ocena dokładności modelowania numerycznego na przykładzie piezorezystancyjnego krzemowego czujnika ciśnienia | VI Konferencja Naukowa Czujniki optoelektroniczne i elektroniczne, Gliwice 2000, t.II, s.462-467 |
| 2000 | Felba J., Kisiel R., Mościcki A. | Mechanical properties of Electrically Conductive Adhesives in PCB Assembly | 23rd International Spring Seminar on Electronics Technology, Balatonfüred 2000, s.180-184 |
| 2000 | Felba J., Friedel K., Mościcki A. | Characterization and Performance of Electrically Conductive Adhesives for Microwave Applications | 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo 2000, s.232-239 |
| 1999 | Cyrański R., Konarski P., Wymysłowski A., Sobolewski A., Magiećko H., Marks J., Pytkowski S. | Konstrukcja i wyniki badań pomp jonowo-sorpcyjnych PJ-50 i PJ-400 | Prace Naukowe Politechniki Warszawskiej, Elektronika, z.123, 1999 (V Krajowa Konferencja Techniki Pró?ni), s.109-112 |
| 1999 | Felba J. | Wiązka elektronowa w technice | Seminaria Naukowe Wroc?awskiego Towarzystwa Naukowego, 1(52) B, 1999, s.95-99 |
| 1999 | Wymysłowski A. | FEM modeling of a piezoresistive silicon pressure sensor | 4th International Workshop ECMS'99, Liberec (Czech Rep.), 1999, p.31-34 |
| 1999 | Konarski P., Iwanejko I., Wymysłowski A. | Trawienie jonowe mikrocząstek pyłów zanieczyszczających środowisko | Prace Naukowe Politechniki Warszawskiej, Elektronika, z.133, 1999 (V Krajowa Konferencja Techniki Pró?ni), s.93-96 |
| 1999 | Felba J., Sielanko W. | Możliwości modyfikacji wiązką elektronową warstwy wierzchniej stopów aluminium | Prace Naukowe Politechniki Warszawskiej, Elektronika, z.123, 1999 (V Krajowa Konferencja Techniki Pró?ni), s.211-214 |
| 1999 | Felba J., Friedel K.P., Habeck M., Krull P., Nitsche-Pagel T., Pobol I.L., Wohlfahrt H. | The process optimization of electron beam active brazing of cubic boron nitride to tungsten carbide cutting tools | Prace Naukowe Politechniki Warszawskiej, Elektronika, z.123, 1999 (V Krajowa Konferencja Techniki Pró?ni), p.207-210 |
| 1999 | Felba J., Friedel K.P., Krull P. Nesteruk I.G., Pobol I.L. | Obtaining of CBN-steel and CBN-tungsten carbide joints using electron beam active brazing | Prace Naukowe Politechniki Warszawskiej, Elektronika, z.133, 1999 (V Krajowa Konferencja Techniki Pró?ni), s.60-64 |
| 1999 | Felba J. | Emittance of high-power-density electron beam | . |
| 1999 | Wymysłowski A., Friedel K. | The Thermo-Mechanical Analysis of Silicon Piezoresistive Pressure Sensors | Transaction on the Precision and Electronic Technology, vol.4, 1999 (4th International Seminar in Precision and Electronic Technology, Warszawa 1999) |
| 1999 | Dziuban J., Friedel K., Chotomski A. | The Thermo-Mechanical Modeling of Silicon Piezoresistive Pressure Sensors in the Single or Twin-Chips Configuration | 23rd Conference of the International Microelectronics and Packaging Society - Poland Chapter, Ko?obrzeg 1999, p.257-262 |
| 1999 | Felba J., Friedel K.P., Laska W., Mościcki A., Piotrowski A. | Investigation of the electrically conductive adhesives formulation for high frequency applications | 23rd Conference of the International Microelectronics and Packaging Society - Poland Chapter, Ko?obrzeg 1999, p.119-124 |
| 1999 | Dziuban J., Friedel K.P. | The Semi-Flip-Chip attachment for single or twin-chips silicon piezoresistive pressure sensors | 12th European Microelectronics & Packaging Conference, Harrogate (England), 1999, p.61-67 |
| 1999 | Dziuban J., Friedel K. | The silicon piezoresistive pressure sensors in the twin-chips configuration | 4th International Workshop ECMS'99, Liberec (Czech Rep.), 1999, p.31-34 |
| 1999 | Pobol I.L., Nesteruk I.G., Wohlfahrt H., Krull P., Felba J., Friedel K.P. | Elektronno-luchevaya paika kubicheckogo nitrida bora k osnove iz tverdogo splava | Svarka i Rodstvennye Tekhnologii, No.2, Minsk 1999, s.43-46 |
| 1999 | Felba J., Friedel K.P., Laska W., Mo?cicki A. | Electrically conductive adhesives for high frequency applications | 22nd International Spring Seminar on Electronics Technology, Dresden 1999, p.11-15 |
| 1998 | Felba J., Grodziński A., Olszewska-Mateja B. | Utwardzanie wgłębne wiązką elektronową stali oraz stali z napoiną Fe-Cr-C | Mat. I Kongresu Polskiego Towarzystwa Pró?niowego, Kraków 1998, s.226- 231. |
| 1998 | Cyrański R., Konarski P., Wymysłowski A., Sobolewski A. | Pompy jonowo-sorpcyjne o podwyższonej stabilności pompowania gazów szlachetnych i aktywnych | Elektronika, 1998, vol.39, nr.5, s.34-39 |
| 1998 | Wymysłowski A., Konarski P., Cyrański R. | Numeryczna metoda optymalizacji pompy jonowo-sorpcyjnej o ze względu na szybkość pompowania | Elektronika, 1998, vol.39, nr 5, s.27-33 |
| 1998 | Wymysłowski A., Friedel K. | Modelling of a complete silicon pressure sensor structure | 21st International Spring Seminar on Electronic Technology, Neusiedl am See - Austria 1998, p.206-209 |
| 1998 | Wymysłowski A., Friedel K. | A decision support system in electron beam welding | 6eme Colloque International sur le Soudage at la Fusion par Faisceau d'Electrons et Laser, Toulon 1998, p.717-724 |
| 1998 | Wymysłowski A. | Optimization of mechanical and electrical properties of the complete silicon pressure structure | II Konferencja Dydaktyczno-Naukowa, Gliwice 1998, |
| 1998 | Friedel K. | An alternative flip chip attachment using non-deformed Au-stud bumps | 21st International Spring Seminar on Electronic Technology, Neusiedl am See - Austria 1998, p.27-31 |
| 1998 | Felba J., Friedel K., Sielanko W. | Elektronowiązkowa modyfikacja warstwy wierzchniej stali z powłoką chromową | Mat. I Kongresu Polskiego Towarzystwa Pró?niowego, Kraków 1998, s.222- 225. |
| 1998 | Felba J., Friedel K.P. | The improvement of the electron gun for EB welding in the whole beam power range | 6eme Colloque International sur le Soudage at la Fusion par Faisceau d'Electrons et Laser, Toulon 1998, p.603-609 |
| 1998 | Wójcicki S., Friedel K. | Systematical error of the measurement of electron beam emittance | Vacuum, 1998, vol.51, No. 2, p.113-118 |
| 1997 | Łoziński W., Friedel K. | Wetting behaviour of some lead-free solder alloys in the case of protected copper surfaces | 21st Conference of the International Society for Hybrid Microelectronics- Poland Chapter, Ustro? 1996, p.201-204 |
| 1997 | Bukat K., Friedel K., Kisiel R., Morawska Z. | Wpływ parametrów lutowania na zwilżalność połączeń wykonywanych lutami bezołowiowymi | VI Konferencja Naukowa Technologia Elektronowa ELTE'97, Krynica 1997, s.129-132 |
| 1997 | Dąbek J., Friedel K. | Spawanie podwójnie załamaną, wirującą wiązką elektronową | Elektronika, 1997, vol.38, nr 3, s.27-29 |
| 1997 | Decker I., Felba J., Friedel K.P., Maul C., Overrath J., Wohlfahrt H. | A temperature measuring system for process control of CBN-metal electron beam active brazing | 5th International Conference on Electron Beam Technologies, Varna 1997, p.165-170 |
| 1997 | Denbnovetsky S.V., Felba J., Melnik V.I., Melnik I.V. | Model of beam formation in a glow discharge electron gun with cold cathode | Applied Surface Science 111 (1997), p.288-1997 |
| 1997 | Friedel K., Kisiel R., Łoziński W. | A study of wetting performance of lead-free solders | 20th International Spring Seminar on Electronic Technology, Szklarska Por?ba, 1997, p.13-18 |
| 1997 | Felba J., Friedel K., Sielanko W., Wójcicki S., Wymysłowski A. | Wpływ parametrów strefy aktywnej wiązki elektronowej na kształt i jakość spoiny | Elektronika, 1997, vol. 38, nr 3, s.7-11 |
| 1997 | Felba J., Friedel K., Sielanko W., Wójcicki S., Wymysłowski A. | Badania wpływu strefy aktywnej wiązki elektronowej na jakość połączeń spawanych elektronowo | VI Konferencja Naukowa Technologia Elektronowa ELTE'97, Krynica 1997, s.311-314. |
| 1997 | Felba J., Friedel K.P., Wójcicki S | The optimization of triode electron gun with thermonic cathode | Applied Surface Science 111 (1997), p.126-134 |
| 1997 | Felba J., Melnik V.I., Sielanko W., Tugai B. | Wybrane metody ograniczania wadliwości spoin wykonywanych wiązką elektronów | VI Konferencja Naukowa Technologia Elektronowa ELTE'97, Krynica 1997, s.315-1997 |
| 1997 | Felba J., Słówko W. | System for weld face observation in electron beam welding machine | 5th International Conference on Electron Beam Technologies, Varna 1997, p.171-175 |
| 1997 | Friedel K. | Badanie wpływu strefy aktywnej wiązki elektronowej na jakość połączeń spawanych elektronowo | Elektronika, 1997, vol.38, nr 3, s.5-6 |
| 1997 | Pobol.I.L., Nesteruk I.G., Felba J., Friedel K. | Badania zjawisk na granicach faz ceramika - metal w połączeniach wykonanych wiązka elektronową | VI Konferencja Naukowa Technologia Elektronowa ELTE'97, Krynica 1997, s.417-420. |
| 1997 | Friedel K., Gaczol M., Wymysłowski A. | Komputerowy system doradczy do spawania elektronowego w próżni | VI Konferencja Naukowa Technologia Elektronowa ELTE'97, Krynica 1997, s.319-322 |
| 1997 | Pobol I.L., Felba J., Friedel K., Nesteruk I.G. | Lutowanie regularnego azotku boru ze stalą narzędziową przy użyciu wiązki elektronowej | Elektronika, 1997, vol. 38, nr 5, s.43-1997 |
| 1997 | Friedel K., Sielanko W. | Przegląd metod wytwarzania wiązek elektronowych dużej mocy, stosowanych w technologii spawania elektronowego | Elektronika, 1997, vol.38, nr 3, s.39-45 |
| 1997 | Friedel K., Sielanko W., | Modyfikacja powierzchni i spawanie wysokoenergetyczna wiązką elektronową | VI Konferencja Naukowa Technologia Elektronowa ELTE'97, Krynica 1997, s.233-236 |
| 1997 | Friedel K., Wymysłowski A. | System ekspertowy w technologii spawania elektronowego | Elektronika 1997, nr 3, s.12-17 |
| 1997 | Friedel K., Wymysłowski A. | Application of an expert system in electron beam welding | 5th International Conference on Electron Beam Technologies, Varna 1997, p.131-136 |
| 1997 | Kisiel R., Friedel K., Bukat K | Ekologiczne materiały i technologie w montażu aparatury elektronicznej | VI Konferencja Naukowa Technologia Elektronowa ELTE'97, Krynica 1997, s.87-90 |
| 1997 | Denbnovetskii S.V., Melnik V.I., Tugai B.A. Sielanko V., Felba J. | Sistema formirowania kvazi-dvoinogo elektronnogo puchka | Elektronika i svyaz, nr 3, cz.II, 1997, s.14-16. |
| 1997 | Friedel K | The guidelines for selecting electrically and thermally conductive adhesives for use in assembly of microsystems | 3rd International Seminar in Precision and Electronic Technology, Warszawa 1997, p.19-20 |
| 1997 | Felba J., Friedel K.P., Sielanko W., Wójcicki S. | The method of weld defects prevention in electron beam welding | 5th International Conference on Electron Beam Technologies, Varna 1997, p176-181 |
| 1997 | Dulak T., Friedel K. | The technology of mechanical Au-stud bumping | 21st Conference of the International Society for Hybrid Microelectronics- Poland Chapter, Ustro? 1997, p.109-112 |
| 1997 | Felba J. | Specjalne metody kształtowania wiązek elektronowych, stosowanych w technologii spawania elektronowego | Elektronika, 1997, vol. 38, nr 3, s.7-11 |
| 1997 | Felba J., Friedel K. | Optymalizacja triodowej wyrzutni elektronowej dużej mocy | Elektronika, 1997, vol. 38, nr 3, s.18-21 |
| 1997 | Felba J., Friedel K. | Application of Taguchi method for electron gun optimization | 5th International Conference on Electron Beam Technologies, Varna 1997, p.17-22 |
| 1997 | Denbnovetsky S.V., Felba J., Melnik I.V., Melnik V.I. | The design of a glow discharge electron gun with cold cathode by means of experimentally verified model of beam formation | 5th International Conference on Electron Beam Technologies, Varna 1997, p.23-1997 |
| 1997 | Denbnovetsky S.V., Felba J., Melnik V.I., Melnik I.V. | Model formowania wiązki elektronowej w wyrzutni plazmowej z metalową katodą zimną | VI Konferencja Naukowa Technologia Elektronowa ELTE'97, Krynica 1997, s.289-1997 |
| 1996 | Friedel K., Pobol I. | Optymalizacja procesu powierzchniowego hartowania elektronowego stali | Hut.Wiad. Hut. 1996, vol. 63, nr 7, s.247-253 |
| 1996 | Felba J. | Wytwarzanie i pomiary wiązki elektronowej o dużej gęstości mocy | Oficyna Wydawnicza Politechniki Wrocławskiej, Wrocław 1996, 131s. |
| 1996 | Bukat K., Friedel K., Kisiel R., Morawska Z., Pieńkowska B. | Influence of halide content on wetting properties of solder-flux systems | 20th Conference of the International Society for Hybrid Microelectronics. Poland Chapter, Jurata 1996, p.101-104 |
| 1996 | Friedel K., Felba J., Pobol I., Wymysłowski A. | A systematic method for optimizing the electron beam hardening process | Vacuum, 1996, vol. 47, No.10, p.1317-1324 |
| 1996 | Friedel K., Wymysłowski A. | High spatial resolution measurement method of metal work function | 9th Conference on Electron Microscopy of Solids, Zakopane 1996, p.113-116 |
| 1996 | Kisiel R., Friedel K. | Design of experiments: joint action of lead-free solders with low-solid fluxes | 19th International Spring Seminar on Electronic Technology, God - Hungary, 1996, p.124-128 |
| 1996 | Kisiel R., Friedel K., Bukat K. | New materials technological trends in PCB manufacture and assembly | 20th Conference of the International Society for Hybrid Microelectronics. Poland Chapter, Jurata 1996, p.31-37 |
| 1996 | Słówko W., Drzazga W., Felba J. | Low voltage scanning electron microscope with a combined multi-electrode retarding lens and detector | Vacuum, 1996, vol. 47, No.10, p.1159-1162 |
| 1996 | Wymysłowski A. | An expert system in field of electron beam welding | 5th International Scientific Conference on Mechanical and Materials Engineering, Gliwice-Wisła 1996, p.265-268 |
| 1996 | Friedel K. | The repeatability of mechanical Au-stud bumps formation | 20th Conference of the International Society for Hybrid Microelectronics. Poland Chapter, Jurata 1996, p.129-132 |
| 1995 | Felba J. | Diagnostic methods of electron beam used for thermal processes | 18th International Spring Seminar on Electronic Technology, Temesvar -Czech Republic, 1995, p.219-223 |
| 1995 | Wójcicki S., Friedel K. | Projektowanie wyrzutni elektronowych dużej mocy z wykorzystaniem reguł skalowania systemów elektrono-optycznych | Elektronika 1995, vol.36, nr 11, s.32-36 |
| 1995 | Friedel K., Wymysłowski A. | Contactless electron beam surface potential measurements and testing of networks | 18th International Spring Seminar on Electronic Technology, Temesvar-Czech Republic, 1995, p.214-218 |
| 1995 | Friedel K., Sielanko W. | Future aspects of electron beam welding and surface modification | Kovine, Zlit. Technol. 1995, vol.29, nr 3/4, p.369-376 |
| 1995 | Friedel K. Friedel Z. | Orthogonal design for optimization of packages thermal resistance | 2nd Int. Seminar in Precision and Electronic Technology, Warszawa 1995, p.111-118 |
| 1995 | Friedel K. | Future needs and requirements for high-density printed circuit boards | 19th Conference of the International Society for Hybrid Microelectronics. Poland Chapter, Por?bka-Kozubnik, 1995, p.83-88 |
| 1994 | Felba J., Friedel K., Sielanko W., Wójcicki S., Wymysłowski A | Application of experimental design to emittance improvement of electron gun with indirectly heated cathode | 4th International Conference on Electron Beam Technologies, Varna 1994, p.63-68 |
| 1994 | Wymysłowski A., Bielawski M. | A computer modeling of surface heat source for electron beam hardening | 4th International Conference on Electron Beam Technologies, Varna 1994, p.143-148 |
| 1994 | Friedel K., Grodziński A., Sielanko W., Wójcicki S. | Spawanie elektronowe - Perspektywy rozwoju | V Konferencja Naukowa ELTE.94, Szczyrk 1994, s.789-794 |
| 1994 | Friedel K., Felba J. | Experimental study of high power electron gun | 4th International Conference on Electron Beam Technologies, Varna 1994, p.69-76 |
| 1994 | Friedel K., Felba J. | Quantitative study of experimental emittance diagrams | 4th International Conference on Electron Beam Technologies, Varna 1994, p.55-62 |
| 1994 | Friedel K., Felba J. | Analiza fazowa wiązki elektronowej dużej mocy | V Konferencja Naukowa. ELTE.94, Szczyrk 1994, s.845-848 |
| 1994 | Friedel K., Felba J. | Measurements of beam emittance in electron beam welding | Weld.Int. 1994, vol.8, No.3, p.176-180 |
| 1994 | Felba J., Olszewska-Mateja B. | Zastosowanie wiązki elektronowej do zwiększenia trwałości narzędzi urabiających | V Konferencja Naukowa ELTE.94, Szczyrk 1994, s.842-843 |
| 1994 | Felba J., Friedel K., Sielanko W., Wójcicki S., Wymysłowski A. | Zastosowanie statystycznej metody projektowania doświadczeń do optymalizacji wyrzutni elektronowej z katodą pośrednio żarzoną | V Konferencja Naukowa ELTE.94, Szczyrk, s.838-841 |
| 1994 | Friedel K. | Application of Taguchi methods to improvement of packages thermal performance | 18th Conference of the International Society for Hybrid Microelectronics. Poland Chapter, Warszawa, 1994, p.113-116 |
